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SPC5601PEF0MLH6

NXP Semiconductors

SPC5601PEF0MLH6 by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;

Median Price

$12.050

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 160 parts In-Stock

1+ parts

$16.620

100+ parts

$12.330

1k+ parts

$11.874

10k+ parts

-

160

$16.620

$12.330

$11.874

-

Rochester

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$9.640

1k+ parts

$8.630

10k+ parts

$8.120

120

-

$9.640

$8.630

$8.120

Verical

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$12.050

1k+ parts

$10.787

10k+ parts

$10.150

115

-

$12.050

$10.787

$10.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 870 parts In-Stock

1+ parts

$8.512

100+ parts

-

1k+ parts

-

10k+ parts

-

870

$8.512

-

-

-

Vyrian

USA . 8,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,040

-

-

-

-

Anansix

USA . 1,794 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,794

-

-

-

-

DigiKey Marketplace

USA . 115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

115

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,538 parts In-Stock

1+ parts

$8.064

100+ parts

-

1k+ parts

-

10k+ parts

-

2,538

$8.064

-

-

-

Vigor

Singapore . 160 parts In-Stock

1+ parts

$15.550

100+ parts

-

1k+ parts

-

10k+ parts

-

160

$15.550

-

-

-

Microchip USA

USA . 2,765 parts In-Stock

1+ parts

$43.204

100+ parts

-

1k+ parts

-

10k+ parts

-

2,765

$43.204

-

-

-

A-Z Elektronik GmbH

Germany . 6,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,324

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,000

-

-

-

-

UNI Independent Distributors

Spain . 332 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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332

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-

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-

Technical Specifications

Microcontrollers SPC5601PEF0MLH6 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Speed:

64 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SPC5601PEF0MLH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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