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SCC68681C1N40,112

NXP Semiconductors

SCC68681C1N40,112 by NXP Semiconductors

SCC68681C1N40,112 by NXP Semiconductors is a Serial Communication Controller with 5V supply, 4 MHz clock frequency, and 0.125 MBps data transfer rate. It is used for asynchronous communication in commercial-grade applications requiring serial I/O interfacing.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,572 parts In-Stock

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Anansix

USA . 2,497 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Digiode

USA . 165 parts In-Stock

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165

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AZTECH Wire

Italy . 569 parts In-Stock

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$14.867

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569

$14.867

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Ampacity Inc.

Singapore . 934 parts In-Stock

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$16.000

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One Stop Electronics

USA . 1,614 parts In-Stock

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$19.000

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$26.594

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$24.201

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$21.807

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2,000

$26.594

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$21.807

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Microchip USA

USA . 483 parts In-Stock

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$26.879

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UNI Independent Distributors

Spain . 5,301 parts In-Stock

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Corphita

USA . 739 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Experience seamless and reliable communication with the SCC68681C1N40,112 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality Serial Communication Controllers that are versatile and efficient. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers seeking high-performance solutions. Trust NXP Semiconductors to provide you with the advanced technology you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and durable, ideal for portable or rugged applications.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power supply options and ensures compatibility with a wide range of systems.

Address Bus Width: 4

The 4-bit address bus width enables efficient communication with connected devices and improves overall system performance.

Package Shape: RECTANGULAR

The rectangular package shape simplifies installation and integration into existing systems or circuit designs.

Data Encoding or Decoding Method: NRZ

The NRZ data encoding or decoding method ensures reliable data transmission and reception, reducing errors in communication.

Maximum Clock Frequency: 4 MHz

The high maximum clock frequency allows for fast data transfer rates, making the product suitable for high-speed communication applications.

No. of Serial I/Os: 2

Having 2 serial I/Os provides flexibility in connecting multiple devices or peripherals, enhancing the product's versatility.

Technical Specifications

Serial Communication Controllers SCC68681C1N40,112 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

4

Boundary Scan:

NO

Bus Compatibility:

S68000

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDIP-T40

JESD-609 Code:

e3

Length:

52 mm

Low Power Mode:

NO

No. of Serial I/Os:

2

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

SCC68681C1N40,112 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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