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SCC2691AC1A28,623

NXP Semiconductors

SCC2691AC1A28,623 by NXP Semiconductors

NXP Semiconductors' SCC2691AC1A28,623 is a Serial Communication Controller with 5.5V max supply voltage, 4MHz clock frequency, and 0.0046875 MBps data transfer rate. It is used for asynchronous communication in serial IO applications requiring low power mode and operates within a temperature range of 0-70°C.

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Vyrian

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Nova Conductors

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Bristol Electronics

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AZTECH Wire

Italy . 868 parts In-Stock

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One Stop Electronics

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Microchip USA

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Aranea Global

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Corphita

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Overview

Unlock seamless communication and connectivity with the NXP Semiconductors SCC2691AC1A28,623 Serial Communication Controller. Crafted with precision and expertise, this innovative chip carrier offers unparalleled quality and reliability for a wide range of applications. From IoT devices to industrial automation systems, this versatile component ensures efficient data transfer at a lightning-fast speed of 0.0046875 MBps. Elevate your projects with the superior performance and low power mode of the SCC2691AC1A28,623, setting new standards in communication technology. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and simplifying production processes.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in power source options.

Address Bus Width: 3

A wider address bus allows for more efficient data transfer and communication between components.

Package Shape: SQUARE

Square package shape facilitates easy placement and alignment on the circuit board.

No. of Terminals: 28

Sufficient number of terminals for connecting to various components and peripherals in the system.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides a compact form factor suitable for space-constrained applications.

Minimum Supply Voltage: 4.5 V

With a low minimum supply voltage, the product can operate efficiently even with lower power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions.

Maximum Data Transfer Rate: 0.0046875 MBps

Fast data transfer rate enables quick and efficient communication between devices.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows the product to function in a wide range of temperature conditions.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections on the PCB.

Maximum Seated Height: 4.57 mm

Low seated height ensures compatibility with slim and compact device designs.

Width: 11.505 mm

Compact width enables easy integration into tight spaces on the circuit board.

Data Encoding or Decoding Method: NRZ

NRZ encoding/decoding method simplifies data transmission and reception processes.

External Data Bus Width: 8

Wider external data bus width allows for simultaneous transfer of more data, improving overall system performance.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol and bit-level data transmission ensures compatibility with a wide range of systems.

Maximum Clock Frequency: 4 MHz

High maximum clock frequency enables fast data processing and communication speeds.

Length: 11.505 mm

Compact length ensures easy placement and alignment on the circuit board.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed specifically for serial communication applications, providing optimized functionality for data transfer.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: J BEND

J Bend terminal form allows for secure and space-saving connections to the PCB.

Maximum Supply Current: 2 mA

Low maximum supply current consumption helps in conserving energy and extending battery life.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures compatibility with standard power sources.

Terminal Pitch: 1.27 mm

Optimal terminal pitch facilitates easy soldering and assembly during manufacturing processes.

Low Power Mode: YES

Low power mode option further enhances energy efficiency and prolongs the product's operational lifespan.

Technical Specifications

Serial Communication Controllers SCC2691AC1A28,623 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.0046875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

1

No. of Serial I/Os:

1

No. of Terminals:

28

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

SCC2691AC1A28,623 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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