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SC16C750BIB64,151

NXP Semiconductors

SC16C750BIB64,151 by NXP Semiconductors

SC16C750BIB64,151 by NXP Semiconductors is a Serial Communication Controller with 64 terminals. It operates at a max clock frequency of 48 MHz and supports data transfer rates up to 0.375 MBps. Ideal for industrial applications requiring low power consumption and asynchronous communication protocols.

Median Price

$2.844

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$2.844

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200

$2.844

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Vyrian

USA . 7,047 parts In-Stock

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7,047

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Flip Electronics

USA . 5,760 parts In-Stock

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5,760

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Digiode

USA . 3,469 parts In-Stock

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3,469

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Anansix

USA . 1,313 parts In-Stock

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1,313

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 1,133 parts In-Stock

1+ parts

$2.844

100+ parts

$2.702

1k+ parts

$2.567

10k+ parts

$2.531

1,133

$2.844

$2.702

$2.567

$2.531

Ampacity Inc.

Singapore . 398 parts In-Stock

1+ parts

$3.000

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398

$3.000

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Microchip USA

USA . 263 parts In-Stock

1+ parts

$9.376

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263

$9.376

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$14.431

100+ parts

$13.132

1k+ parts

$11.833

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40

$14.431

$13.132

$11.833

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AZTECH Wire

Italy . 888 parts In-Stock

1+ parts

$19.017

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888

$19.017

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One Stop Electronics

USA . 1,173 parts In-Stock

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$22.000

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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UNI Independent Distributors

Spain . 4,933 parts In-Stock

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Corphita

USA . 2,482 parts In-Stock

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2,482

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Overview

Experience seamless and reliable communication with the SC16C750BIB64,151 by NXP Semiconductors. As a leader in serial communication controllers, NXP delivers top-notch quality and performance. Ideal for various applications, this product offers unmatched value and benefits to customers. With low power mode, high data transfer rates, and industrial-grade temperature tolerance, the SC16C750BIB64,151 ensures smooth operation in any environment. Upgrade your systems with this cutting-edge solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and lightweight design, making it ideal for various applications.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

Provides a wide range of voltage compatibility, offering flexibility in power source selection.

Address Bus Width: 3

Allows for efficient data processing and communication between connected devices.

Package Shape: SQUARE

Utilizes space efficiently and fits well in compact electronic systems.

Power Supplies (V): 2.5/5

Offers dual voltage options for compatibility with different power sources and energy efficiency.

No. of Terminals: 64

Provides ample connectivity options for interfacing with external devices and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Offers a sleek and compact design for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Ensures stable operation even in low voltage conditions, enhancing reliability.

Maximum Operating Temperature: 85 °C

Allows for operation in high-temperature environments without compromising performance.

Maximum Data Transfer Rate: 0.375 MBps

Enables fast and efficient data transmission, enhancing system responsiveness.

Minimum Operating Temperature: -40 °C

Ensures reliable performance in cold environments, making it suitable for various temperature conditions.

Terminal Finish: Tin (Sn)

Provides corrosion resistance and ensures stable electrical connections for extended product life.

Terminal Position: QUAD

Facilitates secure and stable mounting on circuit boards, preventing signal interference and ensuring reliability.

Maximum Seated Height: 1.6 mm

Offers a low-profile design for compact electronic devices with space constraints.

Width: 10 mm

Features a slim profile for easy integration into compact electronic systems.

External Data Bus Width: 8

Supports high-speed data transfer and efficient communication between peripheral devices.

Communication Protocol: ASYNC, BIT

Enables versatile and reliable data communication with compatibility across different systems.

Maximum Clock Frequency: 48 MHz

Provides high-speed operation for quick data processing and smooth system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and component integrity during manufacturing processes.

Peak Reflow Temperature °C: 260

Maintains component stability during soldering operations, preventing damage and ensuring reliability.

Length: 10 mm

Offers a compact form factor for space-efficient integration into electronic systems.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring durability and reliability under challenging conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Provides versatile connectivity options for seamless integration with various peripherals and devices.

Technology: CMOS

Features advanced CMOS technology for efficient power consumption and high-speed data processing capabilities.

Terminal Form: GULL WING

Facilitates secure and reliable solder connections for stable electrical performance.

Nominal Supply Voltage: 5 V

Ensures compatibility with standard 5V power sources for easy integration and operation.

Terminal Pitch: 0.5 mm

Offers precise terminal spacing for secure mounting and signal transmission.

Low Power Mode: YES

Incorporates energy-saving features for reduced power consumption and longer battery life.

Technical Specifications

Serial Communication Controllers SC16C750BIB64,151 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5 V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

48 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

SC16C750BIB64,151 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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