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SAF1760BE

NXP Semiconductors

SAF1760BE by NXP Semiconductors

SAF1760BE by NXP is a robust bus controller with a max supply voltage of 5.5V, operating temp range from -40 °C to 85 °C, and supports data rates up to 240 MBps. Ideal for industrial applications, it features a low-profile flatpack design with 128 terminals. Its AEC-Q100 screening ensures reliability in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,162 parts In-Stock

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Anansix

USA . 1,577 parts In-Stock

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Digiode

USA . 1,399 parts In-Stock

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1,399

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One Stop Electronics

USA . 1,517 parts In-Stock

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$4.000

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Corohmni

South Africa . 1,244 parts In-Stock

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$56.913

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Corphita

USA . 2,238 parts In-Stock

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UNI Independent Distributors

Spain . 2,044 parts In-Stock

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Overview

Unleash the full potential of your designs with the SAF1760BE from NXP Semiconductors—a trusted leader in innovation. This versatile bus controller ensures seamless data transfer, enhancing performance across diverse applications, from automotive to industrial systems. With its robust architecture and AEC-Q100 qualification, you gain reliability and efficiency, ensuring your projects stand out in quality and speed. Experience unparalleled support and a competitive edge that only NXP can offer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures longevity and reliability in various applications.

Surface Mount: YES

Surface mount capability allows for compact design and ease of integration into modern PCB layouts.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V offers flexibility in designs that may require higher power inputs.

Address Bus Width: 17

A 17-bit address bus provides ample addressing capability for expansive memory management.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures quality and reliability, making this product suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for maximizing board space and simplifying layout design.

No. of Terminals: 128

128 terminals provide robust connectivity options for complex systems, facilitating multiple connections.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack and low-profile design enable high-density arrangements, crucial for space-constrained applications.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows for operation in low-power environments, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures functionality in high-temperature environments, crucial for industrial use.

Maximum Data Transfer Rate: 240 MBps

A high data transfer rate of 240 MBps supports demanding applications requiring quick data handling.

Minimum Operating Temperature: -40 °C

Withstand temperatures as low as -40 °C, making it suitable for harsh environments and outdoor applications.

Terminal Position: QUAD

Quad terminal positioning enhances soldering and connection ease, improving assembly efficiency.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6 mm is advantageous for low-profile designs and improving airflow in devices.

Width: 14 mm

A compact width of 14 mm allows for versatile placement options on PCBs without restricting design.

External Data Bus Width: 32

The wide 32-bit external data bus increases throughput and performance for data-intensive applications.

Maximum Clock Frequency: 12 MHz

A maximum clock frequency of 12 MHz ensures timely processing speeds for modern digital applications.

Length: 20 mm

A length of 20 mm strikes a balance between size and performance, suitable for many embedded systems.

Temperature Grade: INDUSTRIAL

Industrial temperature rating guarantees reliability in challenging environments and extended lifespans.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

As a universal serial bus controller, it facilitates easy integration into various electronic devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity which is crucial for portable devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical support and ease of soldering for reliable connections.

Nominal Supply Voltage: 5 V

Operating at a nominal 5 V is compatible with most digital logic circuits, simplifying system design.

Bus Compatibility: PCI

PCI bus compatibility ensures this product can interface with numerous existing infrastructures and devices.

Terminal Pitch: 0.5 mm

Fine 0.5 mm terminal pitch allows for dense layout designs, enabling smaller and more efficient boards.

Technical Specifications

Bus Controllers SAF1760BE attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

17

Bus Compatibility:

PCI

Maximum Clock Frequency:

12 MHz

Maximum Data Transfer Rate:

240 MBps

External Data Bus Width:

32

JESD-30 Code:

R-PQFP-G128

Length:

20 mm

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SAF1760BE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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