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SA601DK

NXP Semiconductors

SA601DK by NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

Median Price

$3.110

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 75 parts In-Stock

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$3.110

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PC Components Company LLC

USA . 19,709 parts In-Stock

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Bristol Electronics

USA . 19,709 parts In-Stock

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Digiode

USA . 4,640 parts In-Stock

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Anansix

USA . 2,524 parts In-Stock

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Vyrian

USA . 1,670 parts In-Stock

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Speed Components Ltd

Israel . 1,100 parts In-Stock

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Connector Distribution Corp

USA . 416 parts In-Stock

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Right Parts Inc.

USA . 416 parts In-Stock

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ComSIT Distribution GmbH

Germany . 368 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 251 parts In-Stock

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ComSIT USA

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ACDS - Activité Composants Distribution Service

France . 106 parts In-Stock

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Dan-Mar Components

USA . 106 parts In-Stock

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A2Z Electronics, Inc.

USA . 19 parts In-Stock

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CirComp Electronics, Inc.

USA . 3 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 224 parts In-Stock

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$160.000

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Kepictronics

USA . 27,550 parts In-Stock

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UNI Independent Distributors

Spain . 6,404 parts In-Stock

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Corphita

USA . 3,584 parts In-Stock

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Assy Fe

Spain . 1,215 parts In-Stock

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Perfect Parts

USA . 125 parts In-Stock

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Technical Specifications

Cellphone ICs SA601DK attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SA601DK Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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