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S9S12D64F0CFUER

NXP Semiconductors

S9S12D64F0CFUER by NXP Semiconductors

MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: HQFP; Package Shape: SQUARE; Boundary Scan: NO;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,101 parts In-Stock

1+ parts

-

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1k+ parts

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7,101

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Digiode

USA . 3,130 parts In-Stock

1+ parts

-

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1k+ parts

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3,130

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Anansix

USA . 2,797 parts In-Stock

1+ parts

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2,797

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ComSIT Distribution GmbH

Germany . 1,410 parts In-Stock

1+ parts

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1,410

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 534 parts In-Stock

1+ parts

$20.320

100+ parts

-

1k+ parts

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10k+ parts

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534

$20.320

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One Stop Electronics

USA . 338 parts In-Stock

1+ parts

$22.000

100+ parts

-

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338

$22.000

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Vigor

Singapore . 2,723 parts In-Stock

1+ parts

$26.510

100+ parts

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1k+ parts

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2,723

$26.510

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Microchip USA

USA . 2,425 parts In-Stock

1+ parts

$48.889

100+ parts

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2,425

$48.889

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UNI Independent Distributors

Spain . 4,253 parts In-Stock

1+ parts

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4,253

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Corphita

USA . 4,027 parts In-Stock

1+ parts

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4,027

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iodParts Technologies Inc.

India . 750 parts In-Stock

1+ parts

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750

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Technical Specifications

Microcontrollers S9S12D64F0CFUER attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

S9S12

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

25 rpm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

S9S12D64F0CFUER Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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