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S912XEG384J3CALR

NXP Semiconductors

S912XEG384J3CALR by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 112; Package Code: LQFP; Package Shape: SQUARE;

Median Price

$12.356

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

S912XEG384J3CALR by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,500 parts In-Stock

1+ parts

$9.140

100+ parts

$8.960

1k+ parts

$8.770

10k+ parts

-

5,500

$9.140

$8.960

$8.770

-

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$15.571

10k+ parts

-

10,000

-

-

$15.571

-

Distributors (In-Stock)

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Digiode

USA . 1,500 parts In-Stock

1+ parts

$8.683

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

$8.683

-

-

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Vyrian

USA . 723 parts In-Stock

1+ parts

$9.140

100+ parts

-

1k+ parts

-

10k+ parts

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723

$9.140

-

-

-

Bristol Electronics

USA . 3,500 parts In-Stock

1+ parts

$10.080

100+ parts

$4.368

1k+ parts

$4.133

10k+ parts

-

3,500

$10.080

$4.368

$4.133

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Anansix

USA . 1,971 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,971

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Distributors (Availability)

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One Stop Electronics

USA . 5,362 parts In-Stock

1+ parts

$7.770

100+ parts

-

1k+ parts

-

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5,362

$7.770

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-

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Corphita

USA . 4,885 parts In-Stock

1+ parts

$8.226

100+ parts

-

1k+ parts

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10k+ parts

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4,885

$8.226

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-

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Vigor

Singapore . 5,500 parts In-Stock

1+ parts

$11.050

100+ parts

-

1k+ parts

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10k+ parts

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5,500

$11.050

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QUARKTWIN TECHNOLOGY LTD

USA . 25,087 parts In-Stock

1+ parts

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25,087

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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8,000

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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UNI Independent Distributors

Spain . 2,177 parts In-Stock

1+ parts

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2,177

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Microchip USA

USA . 1,925 parts In-Stock

1+ parts

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1,925

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Technical Specifications

Microcontrollers S912XEG384J3CALR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

CPU12

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G112

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

91

No. of Terminals:

112

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP112,.87SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.72 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

S912XEG384J3CALR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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