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PX1011BI-EL1/G,518

NXP Semiconductors

PX1011BI-EL1/G,518 by NXP Semiconductors

PX1011BI-EL1/G,518 by NXP Semiconductors is a robust bus controller designed for industrial applications. It operates within -40 °C to 85 °C and supports power supplies of 1.2V, 2.5V, and 3.3V with a max supply current of 35mA. Its fine pitch grid array package ensures efficient surface mounting in compact designs.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 1,715 parts In-Stock

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Vyrian

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Digiode

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Anansix

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ACDS - Activité Composants Distribution Service

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AZTECH Wire

Italy . 409 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 88 parts In-Stock

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Component Stockers USA

USA . 461 parts In-Stock

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UNI Independent Distributors

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Corphita

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Overview

Unlock the potential of your designs with the PX1011BI-EL1/G,518 from NXP Semiconductors, a leader in innovation. This robust bus controller delivers exceptional reliability and performance, ensuring seamless communication in industrial environments. Its versatile temperature range and compact design make it ideal for diverse applications, enhancing efficiency while reducing costs. Choose NXP for unmatched quality and elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing durable plastic/epoxy materials ensures reliability and protection against environmental factors, making it suitable for industrial applications.

Surface Mount: YES

The surface mount design allows for efficient use of PCB space and facilitates automated assembly processes, boosting production efficiency.

Package Shape: SQUARE

The square package shape maximizes the surface area for connections, improving thermal and electrical performance.

Power Supplies (V): 1.2, 2.5, 3.3

Multiple voltage supply options enhance versatility, allowing the bus controller to be integrated into a variety of systems.

No. of Terminals: 81

With 81 terminals, this product offers a high degree of connectivity, making it suitable for complex applications that require multiple interfaces.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array design allows for higher density routing on PCBs, which is beneficial for space-constrained applications.

Maximum Operating Temperature: 85 °C

Operating efficiently at up to 85 °C ensures reliable performance in high-temperature environments typical in industrial settings.

Minimum Operating Temperature: -40 °C

The capability to function in extreme low temperatures (-40 °C) makes it ideal for applications in harsh environments.

Terminal Position: BOTTOM

The bottom terminal position provides enhanced electrical connectivity and minimizes the length of traces on the circuit board.

Peak Reflow Temperature °C: 260

Designed to withstand a peak reflow temperature of 260 °C, ensuring compatibility with various soldering processes during assembly.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature applications means it is built to last in challenging conditions, ensuring durability.

Technology: CMOS

The use of CMOS technology leads to low power consumption and high-speed performance, making it efficient for various applications.

Terminal Form: BALL

Ball terminal form enhances the reliability of connections, providing solid solder joints and reducing the risk of mechanical failure.

Maximum Supply Current: 35 mA

A maximum supply current of 35 mA allows for efficient power usage, making it suitable for energy-sensitive applications.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch strikes a balance between space savings and routing ease, facilitating compact PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, allowing for appropriate handling and storage while ensuring product longevity.

Technical Specifications

Bus Controllers PX1011BI-EL1/G,518 attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B81

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

81

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA81,9X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,2.5,3.3

Qualification:

Not Qualified

Sub-Category:

Bus Controllers

Maximum Supply Current:

35 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

PX1011BI-EL1/G,518 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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