Loading...

PX1011BI-EL1/G-S

NXP Semiconductors

PX1011BI-EL1/G-S by NXP Semiconductors

PX1011BI-EL1/G-S by NXP Semiconductors is a robust bus controller designed for industrial applications. It operates within -40 °C to 85 °C, supports power supplies of 1.2V to 3.3V, and features a fine pitch grid array with 81 terminals. Ideal for reliable performance in demanding environments, it utilizes CMOS technology for efficient operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,554

-

-

-

-

Vyrian

USA . 535 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

535

-

-

-

-

Digiode

USA . 420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

420

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 413 parts In-Stock

1+ parts

$24.075

100+ parts

-

1k+ parts

-

10k+ parts

-

413

$24.075

-

-

-

One Stop Electronics

USA . 599 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

599

$28.000

-

-

-

UNI Independent Distributors

Spain . 3,409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,409

-

-

-

-

Corphita

USA . 356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

356

-

-

-

-

Overview

Experience unparalleled performance with the PX1011BI-EL1/G-S from NXP Semiconductors, a leader in innovative solutions. This advanced bus controller ensures reliability and efficiency across diverse applications, from industrial automation to consumer electronics. With robust temperature resilience and a compact design, it’s perfect for demanding environments. Elevate your projects with NXP's commitment to quality and cutting-edge technology, unlocking new possibilities for your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction offers durability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier integration into modern electronic systems.

Package Shape: SQUARE

The square package shape can optimize space on the PCB, facilitating better component placement and layout.

Power Supplies (V): 1.2, 2.5, 3.3

Multiple voltage options provide versatility, allowing compatibility with a wide range of systems and designs.

No. of Terminals: 81

A higher number of terminals supports extensive functionality and connectivity, catering to complex bus controller needs.

Package Style (Meter): GRID ARRAY, FINE PITCH

This packaging style enables a fine pitch for interconnectivity, which is beneficial for high-density designs.

Maximum Operating Temperature: 85 °C

Withstanding high temperatures ensures reliability and longevity in demanding environments.

Minimum Operating Temperature: -40 °C

The wide operational temperature range allows for functionality in extreme conditions, making it suitable for outdoor and harsh applications.

Terminal Position: BOTTOM

Bottom terminal positioning aids in efficient thermal management and electrical performance on PCBs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade enhances reliability and performance in rigorous applications, ensuring stability over time.

Technology: CMOS

CMOS technology is known for low power consumption and high speed, making it ideal for efficient and high-performance operations.

Terminal Form: BALL

Ball form terminals facilitate easy soldering and improve the connection quality, which is crucial for reliable performance.

Maximum Supply Current: 35 mA

A maximum supply current of 35 mA indicates low power consumption, enhancing energy efficiency in devices.

Terminal Pitch: 0.8 mm

The fine terminal pitch supports a compact design and improved routing flexibility on the PCB, allowing for more complex layouts.

Technical Specifications

Bus Controllers PX1011BI-EL1/G-S attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B81

No. of Terminals:

81

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA81,9X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2,2.5,3.3

Qualification:

Not Qualified

Sub-Category:

Bus Controllers

Maximum Supply Current:

35 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

PX1011BI-EL1/G-S Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 7