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PMV117EN,215

NXP Semiconductors

PMV117EN,215 by NXP Semiconductors

PMV117EN,215 by NXP Semiconductors is a N-CHANNEL FET with 30V DS Breakdown Voltage and 2.5A Drain Current. Ideal for SWITCHING applications, it features SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has 0.19 ohm On Resistance and can handle up to 0.83W power dissipation at 150°C.

Median Price

$0.172

Lifecycle Status

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5

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1k+

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Chip1Stop

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Nova Conductors

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Netroflash

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Aztec Data Supply Inc.

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AZTECH Wire

Italy . 11,047 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

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Overview

Unlock the power of NXP Semiconductors with the PMV117EN,215 Small Signal Field Effect Transistor. Perfect for switching applications, this N-CHANNEL transistor offers a seamless experience with its single configuration and built-in diode. With a high operating temperature of 150°C and maximum drain current of 2.5A, this transistor ensures reliability and efficiency in any project. Trust NXP Semiconductors for quality components that deliver exceptional performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL type is commonly used for switching applications, making this transistor suitable for such purposes.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency and performance of the transistor in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor ensures reliable and efficient performance.

Surface Mount: YES

Surface mount capability makes installation and integration of the transistor easier and more convenient.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltages without damage.

Maximum Drain Current (ID): 2.5 A

High maximum drain current rating allows the transistor to handle higher current loads with ease.

Maximum Power Dissipation: 0.83 W

Efficient power dissipation capability ensures that the transistor can operate reliably without overheating.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high temperature environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMV117EN,215 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMV117EN,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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