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PMV16UN

NXP Semiconductors

PMV16UN by NXP Semiconductors

PMV16UN by NXP Semiconductors is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 5.8 A, a breakdown voltage of 20 V, and low on-resistance of 0.018 Ω. Ideal for compact electronic designs with surface mount capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Chip Stock

USA . 103,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 9,755 parts In-Stock

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Vyrian

USA . 6,965 parts In-Stock

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Bristol Electronics

USA . 2,900 parts In-Stock

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Dan-Mar Components

USA . 2,900 parts In-Stock

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Anansix

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Digiode

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AZTECH Wire

Italy . 3,639 parts In-Stock

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$4.260

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One Stop Electronics

USA . 721 parts In-Stock

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$36.050

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Kepictronics

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UNI Independent Distributors

Spain . 7,567 parts In-Stock

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Supply Digital

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Corphita

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Overview

Elevate your projects with the PMV16UN from NXP Semiconductors, a leader in innovation and reliability. This robust N-channel small signal FET combines exceptional switching efficiency with a compact design, making it perfect for a variety of applications—from power management to signal processing. With its built-in diode and superior performance, it ensures durability and improved energy savings, delivering outstanding value and peace of mind for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection for the transistor, making it suitable for various operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel devices typically offer better efficiency and faster switching speeds, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the device's versatility, allowing it to handle inductive loads and providing an extra layer of protection.

Transistor Application: SWITCHING

Designed for switching applications, this FET enables effective control of power circuits, improving overall system efficiency.

Surface Mount: YES

Surface mount capability allows for easier integration into modern circuit designs, contributing to reduced board space and weight.

Minimum DS Breakdown Voltage: 20 V

A minimum breakdown voltage of 20V ensures reliable operation in various environments, protecting against voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape is common and efficient for PCB layout, simplifying assembly and promoting reliability in connections.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance mechanical strength, ensuring reliable connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide improved performance and lower ON resistance when compared to depletion-mode alternatives.

No. of Terminals: 3

A 3-terminal design simplifies circuit integration, making it easier to manage in terms of layout and connectivity.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for compact designs, making it suitable for applications where space is a premium.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and fast switching capabilities, making it preferred in digital and analog applications.

Transistor Element Material: SILICON

Silicon as the base material ensures good thermal stability and performance under various electrical conditions.

Terminal Finish: TIN

Tin finishes provide good solderability and corrosion resistance, enhancing the reliability and longevity of the product.

Maximum Drain Current (ID): 5.8 A

A high maximum drain current allows for handling greater loads, making this transistor suitable for robust switching applications.

Maximum Drain-Source On Resistance: 0.018 ohm

Low on-resistance translates to reduced power loss and heat generation, leading to improved efficiency in operation.

Terminal Position: DUAL

Dual terminal position ensures flexibility in PCB design and layout, accommodating various circuit arrangements.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMV16UN attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW THRESHOLD

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

5.8 A

Maximum Drain-Source On Resistance:

.018 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMV16UN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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