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PMN49EN,165

NXP Semiconductors

PMN49EN,165 by NXP Semiconductors

PMN49EN,165 by NXP Semiconductors is a single N-channel MOSFET ideal for power applications. It supports a max drain current of 4.6 A and operates at temperatures up to 150 °C, ensuring reliable performance in compact designs. Its surface mount configuration enhances versatility in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,393 parts In-Stock

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Digiode

USA . 1,692 parts In-Stock

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1,692

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Anansix

USA . 1,220 parts In-Stock

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1,220

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Distributors (Availability)

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One Stop Electronics

USA . 1,243 parts In-Stock

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$12.050

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$12.050

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UNI Independent Distributors

Spain . 4,342 parts In-Stock

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4,342

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Corphita

USA . 2,746 parts In-Stock

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Microchip USA

USA . 333 parts In-Stock

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333

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Overview

Unlock the potential of your designs with the PMN49EN,165 from NXP Semiconductors—a leader in high-quality electronic components. This N-channel Power FET delivers exceptional efficiency and reliability, ensuring optimal performance in various applications, from power management to motor control. Its surface-mount design simplifies integration, while a robust construction withstands demanding environments. Choose NXP for innovation that drives success in every project!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, resulting in better performance in switching applications.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces space requirements on the PCB.

Surface Mount: YES

Surface mount compatibility allows for automated assembly and better efficiency in manufacturing processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for efficient control of the current flow, making this FET suitable for a wide range of applications.

Maximum Drain Current (Abs) (ID): 4.6 A

A maximum drain current of 4.6 A ensures that this FET can handle significant loads, making it versatile for various applications.

Maximum Power Dissipation (Abs): 1.75 W

With a power dissipation capability of 1.75 W, this FET can operate effectively without risk of overheating in typical applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOS technology used in this FET allows for lower power consumption and improved switching speeds.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliability and performance in high-temperature environments.

Terminal Finish: TIN

The tin finishing of terminals enhances solderability and helps in creating reliable connections during assembly.

Maximum Time At Peak Reflow Temperature (s): 30

The capability to withstand up to 30 seconds at peak reflow temperature indicates its durability during manufacturing processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with lead-free soldering processes, meeting modern industry standards.

Technical Specifications

Power Field Effect Transistors (FET) PMN49EN,165 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

4.6 A

Maximum Drain Current (ID):

4.6 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PMN49EN,165 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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