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PMN40LN,135

NXP Semiconductors

PMN40LN,135 by NXP Semiconductors

PMN40LN,135 by NXP Semiconductors is a N-CHANNEL FET with 30V DS breakdown voltage and 5.4A drain current. Ideal for switching applications, it features a built-in diode, operates in enhancement mode, and has a max power dissipation of 1.75W.

Median Price

$0.287

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24,547 parts In-Stock

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-

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$0.298

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$0.247

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$0.220

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$0.298

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$0.220

Verical

USA . 19,940 parts In-Stock

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$0.276

19,940

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$0.276

Distributors (In-Stock)

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Digiode

USA . 4,036 parts In-Stock

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$0.124

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Vyrian

USA . 3,161 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 250 parts In-Stock

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250

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Anansix

USA . 215 parts In-Stock

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215

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Distributors (Availability)

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Corphita

USA . 3,573 parts In-Stock

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$0.117

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$0.117

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Component Stockers USA

USA . 29,503 parts In-Stock

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$0.130

100+ parts

$0.120

1k+ parts

$0.110

10k+ parts

$0.110

29,503

$0.130

$0.120

$0.110

$0.110

AZTECH Wire

Italy . 7,334 parts In-Stock

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$0.150

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7,334

$0.150

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Continental Prestige Electronics

USA . 24,547 parts In-Stock

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$0.156

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QUARKTWIN TECHNOLOGY LTD

USA . 22,275 parts In-Stock

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UNI Independent Distributors

Spain . 4,820 parts In-Stock

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Supply Digital

USA . 2,886 parts In-Stock

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Perfect Parts

USA . 280 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 250 parts In-Stock

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Glotronic Ltd.

UK . 200 parts In-Stock

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Overview

Elevate your electronic projects with the PMN40LN,135 by NXP Semiconductors, a premium Small Signal Field Effect Transistor that boasts top-notch quality and reliability. Perfect for switching applications, this N-CHANNEL transistor with a built-in diode offers enhanced performance and efficiency. With a maximum drain current of 5.4 A and a minimal on-resistance of 0.038 ohm, this transistor delivers exceptional power dissipation capabilities. Take advantage of its advanced technology and compact design to elevate your projects to new heights. Choose NXP Semiconductors for unparalleled value and performance in semiconductor components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the transistor easy to handle and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher electron mobility, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse polarity protection and simplifies circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient power handling and fast switching speeds.

Surface Mount: YES

Surface mount technology enables high-density board designs and easy automated assembly.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle a range of low to medium voltage applications.

Maximum Drain Current (Abs) (ID): 5.4 A

Capable of handling high current loads, making it suitable for power switching applications.

Maximum Power Dissipation (Abs): 1.75 W

Efficient power dissipation ensures the transistor can operate reliably without overheating.

Maximum Drain-Source On Resistance: 0.038 ohm

Low on-resistance minimizes power losses and improves efficiency in switching applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature range allows for operation in various environmental conditions.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMN40LN,135 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

5.4 A

Maximum Drain Current (ID):

5.4 A

Maximum Drain-Source On Resistance:

.038 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMN40LN,135 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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