Loading...

PMGD130UN,115

NXP Semiconductors

PMGD130UN,115 by NXP Semiconductors

PMGD130UN,115 by NXP Semiconductors is an N-channel MOSFET ideal for power management applications. It supports a max drain current of 1.3 A and operates at up to 150 °C, ensuring reliability in demanding environments. Its surface mount design simplifies integration into compact circuits.

Median Price

$0.120

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,486,750 parts In-Stock

1+ parts

$0.120

100+ parts

$0.120

1k+ parts

$0.120

10k+ parts

-

1,486,750

$0.120

$0.120

$0.120

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,673 parts In-Stock

1+ parts

$0.114

100+ parts

-

1k+ parts

-

10k+ parts

-

2,673

$0.114

-

-

-

Vyrian

USA . 5,973 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,973

-

-

-

-

Anansix

USA . 1,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,310

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,486,331 parts In-Stock

1+ parts

$0.102

100+ parts

-

1k+ parts

-

10k+ parts

-

1,486,331

$0.102

-

-

-

Corphita

USA . 1,241 parts In-Stock

1+ parts

$0.108

100+ parts

-

1k+ parts

-

10k+ parts

-

1,241

$0.108

-

-

-

AZTECH Wire

Italy . 792 parts In-Stock

1+ parts

$19.420

100+ parts

-

1k+ parts

-

10k+ parts

-

792

$19.420

-

-

-

Perfect Parts

USA . 40,046 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40,046

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 13,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,149

-

-

-

-

A-Z Elektronik GmbH

Germany . 8,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,572

-

-

-

-

UNI Independent Distributors

Spain . 7,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,128

-

-

-

-

Kepictronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Overview

Elevate your designs with the PMGD130UN,115 from NXP Semiconductors—a top-tier N-channel Power FET crafted for excellence. Known for reliability and performance, NXP ensures unmatched quality, making this transistor perfect for various applications, from power management to automotive systems. Experience superior efficiency and thermal resilience, optimizing your projects while benefiting from NXP's industry expertise and innovative solutions!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility and efficiency, making them ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic assemblies.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer lower on-resistance and higher efficiency, making them suitable for power management applications.

Maximum Drain Current (Abs) (ID): 1.3 A

The ability to handle 1.3 A of continuous current makes this FET versatile for various applications in consumer electronics and industrial systems.

Maximum Power Dissipation (Abs): 0.39 W

With a 0.39 W power dissipation rating, this FET can handle moderate power levels effectively, minimizing thermal issues.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology provides high input impedance and fast switching capabilities, making it suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows the FET to function reliably in demanding environments without performance degradation.

Terminal Finish: TIN

The tin terminal finish ensures good solderability and compatibility with standard assembly processes.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds helps ensure that the component can withstand the soldering process without damage.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C enables compatibility with various soldering techniques, ensuring reliable solder joints.

Technical Specifications

Power Field Effect Transistors (FET) PMGD130UN,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Maximum Drain Current (Abs) (ID):

1.3 A

Maximum Drain Current (ID):

1.3 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PMGD130UN,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 1