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PHK13N03LT,118

NXP Semiconductors

PHK13N03LT,118 by NXP Semiconductors

PHK13N03LT,118 by NXP Semiconductors is an N-channel MOSFET designed for efficient power management. It supports a max drain current of 13.8 A and operates at up to 150 °C, making it ideal for high-performance applications in compact devices. Its surface mount configuration ensures easy integration into modern electronics.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,774 parts In-Stock

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Vyrian

USA . 3,898 parts In-Stock

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Bristol Electronics

USA . 2,500 parts In-Stock

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$0.300

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$0.120

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Anansix

USA . 1,446 parts In-Stock

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1,446

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Distributors (Availability)

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One Stop Electronics

USA . 1,389 parts In-Stock

1+ parts

$32.050

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UNI Independent Distributors

Spain . 7,325 parts In-Stock

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Corphita

USA . 735 parts In-Stock

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Overview

Unlock reliable performance with the PHK13N03LT,118 N-channel Power FET from NXP Semiconductors. Renowned for quality and innovation, NXP delivers a robust solution designed for various applications, ensuring efficiency and longevity. With its superior thermal management and compact surface-mount design, this transistor enhances your electronic projects while minimizing power loss. Experience unmatched value and durability that only a trusted leader can offer!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are typically faster and have higher efficiency compared to P-Channel types, making them ideal for high-speed switching applications.

Configuration: SINGLE

A single configuration allows for simpler circuit design and layout, making it easier to integrate into various applications.

Surface Mount: YES

Surface mount technology reduces space requirements on PCBs and allows for automated assembly, enhancing production efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control over current flow, making them suitable for a wider range of applications requiring precise operation.

Maximum Drain Current (Abs) (ID): 13.8 A

A maximum drain current of 13.8 A allows the device to handle significant load currents, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 6.25 W

With a maximum power dissipation of 6.25 W, this FET effectively manages heat, reducing the risk of thermal failure during operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low on-resistance and high switching speeds, enhancing overall efficiency in electronic circuits.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures reliability and performance in demanding environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances connectivity and corrosion resistance, contributing to long-term reliability in electrical applications.

Moisture Sensitivity Level (MSL): 2

An MSL of 2 indicates a moderate sensitivity to moisture, allowing for standard handling practices during assembly and storage.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds accommodates the manufacturing process without compromising the integrity of the device.

Peak Reflow Temperature °C: 260

This high peak reflow temperature ensures compatibility with lead-free soldering processes, aligning with modern manufacturing standards.

Technical Specifications

Power Field Effect Transistors (FET) PHK13N03LT,118 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

13.8 A

Maximum Drain Current (ID):

13.8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PHK13N03LT,118 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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