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PHK12NQ03LT,118

NXP Semiconductors

PHK12NQ03LT,118 by NXP Semiconductors

PHK12NQ03LT,118 from NXP Semiconductors is a single N-channel MOSFET designed for enhancement mode applications. It supports a max drain current of 12 A and operates at temperatures up to 150 °C, making it ideal for power management in compact devices. Its nickel-palladium-gold finish ensures reliability in surface mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,950 parts In-Stock

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3,950

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Digiode

USA . 2,008 parts In-Stock

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2,008

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Anansix

USA . 530 parts In-Stock

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530

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Distributors (Availability)

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One Stop Electronics

USA . 161 parts In-Stock

1+ parts

$38.050

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161

$38.050

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UNI Independent Distributors

Spain . 6,333 parts In-Stock

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6,333

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Corphita

USA . 2,410 parts In-Stock

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2,410

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Overview

Unlock superior performance with the PHK12NQ03LT,118 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers an N-channel Power FET that excels in efficiency and reliability. Perfect for a range of applications, from automotive to industrial systems, this versatile component ensures smooth operation under demanding conditions. Experience enhanced power management and longevity, making it the ideal choice for your next project!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are typically faster and offer better performance when switching applications, making this product a reliable choice for high-speed circuits.

Configuration: SINGLE

A single configuration allows for simpler circuit design and integration, making it user-friendly for various applications.

Surface Mount: YES

Surface mount technology (SMT) facilitates compact circuit designs and automated manufacturing, optimizing space and cost.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control over high-speed switching operations, which is ideal for modern electronic applications.

Maximum Drain Current (Abs) (ID): 12 A

With a maximum drain current of 12 A, this FET can handle significant load currents, making it suitable for high-performance applications.

Maximum Power Dissipation (Abs): 2.5 W

A power dissipation rating of 2.5 W indicates efficient thermal management, minimizing overheating and enhancing the reliability of the device.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high input impedance and low power consumption, making this FET suitable for energy-efficient electronic devices.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C allows for robust performance in demanding environments, enhancing the durability of the product.

Terminal Finish: NICKEL PALLADIUM GOLD

This attractive terminal finish ensures excellent solderability and long-term reliability, benefiting applications requiring high reliability.

Moisture Sensitivity Level (MSL): 2

An MSL of 2 indicates that the product can be exposed to moisture for a reasonable time without requiring special handling precautions during assembly.

Maximum Time At Peak Reflow Temperature (s): 30

A 30-second peak reflow time allows for effective soldering in manufacturing processes, promoting consistent quality across production runs.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C enables compatibility with various soldering techniques, making it versatile for different assembly processes.

Technical Specifications

Power Field Effect Transistors (FET) PHK12NQ03LT,118 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PHK12NQ03LT,118 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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