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PHK12NQ10T,118

NXP Semiconductors

PHK12NQ10T,118 by NXP Semiconductors

PHK12NQ10T,118 from NXP Semiconductors is an N-channel MOSFET ideal for power applications. It supports a max drain current of 11.6 A and power dissipation of 8.9 W, operating up to 150 °C. This surface-mount FET excels in enhancement mode configurations.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 158,000 parts In-Stock

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Anansix

USA . 1,663 parts In-Stock

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Vyrian

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Digiode

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One Stop Electronics

USA . 1,342 parts In-Stock

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UNI Independent Distributors

Spain . 8,348 parts In-Stock

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Corphita

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Overview

Unlock superior performance with the PHK12NQ10T,118 from NXP Semiconductors. Renowned for their innovation and quality, NXP delivers unmatched reliability in power management applications. This robust N-channel FET excels in efficiency and thermal performance, making it ideal for power supplies, motor control, and more. Experience the difference that cutting-edge technology can make in your designs—maximize output while minimizing footprint!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel transistors are generally favored for their higher electron mobility, resulting in better performance in switching applications.

Configuration: SINGLE

A single configuration allows for simpler circuit designs and easier integration into various applications.

Surface Mount: YES

Surface mount capability enables compact designs and improved performance, particularly in high-frequency applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode offers high input impedance and decreased power consumption, making it ideal for low-power applications.

Maximum Drain Current (Abs) (ID): 11.6 A

With a maximum drain current of 11.6 A, this FET can handle significant loads, making it suitable for power-intensive applications.

Maximum Power Dissipation (Abs): 8.9 W

This level of power dissipation ensures that the transistor can operate efficiently without overheating, ideal for high-power circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for rapid switching speeds and low on-resistance, enhancing performance in digital and analog applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C provides robustness, enabling use in demanding environments where heat generation is a concern.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates a moderate sensitivity to moisture, allowing for reliable storage and handling in typical conditions.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard soldering processes, facilitating easier manufacturing and assembly.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows this FET to withstand the soldering process without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) PHK12NQ10T,118 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

11.6 A

Maximum Drain Current (ID):

11.6 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Moisture Sensitivity Level (MSL):

2

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PHK12NQ10T,118 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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