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P89V51RD2BN,112

NXP Semiconductors

P89V51RD2BN,112 by NXP Semiconductors

NXP Semiconductors P89V51RD2BN,112 is an 8051 microcontroller with 8-bit CPU, 16-bit address bus, and 40 MHz clock frequency. It features 1024 bytes of RAM, 65536 ROM words, and supports PWM channels. Ideal for applications requiring a max supply voltage of 5.5 V and operating temperature range of 0-70°C in commercial-grade settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,215 parts In-Stock

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Vyrian

USA . 460 parts In-Stock

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Anansix

USA . 120 parts In-Stock

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Nova Conductors

Japan . 70 parts In-Stock

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70

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Ampacity Inc.

Singapore . 1,289 parts In-Stock

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$2.000

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One Stop Electronics

USA . 1,162 parts In-Stock

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AZTECH Wire

Italy . 369 parts In-Stock

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Semicontronic

India . 2,122 parts In-Stock

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$17.460

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Aztec Data Supply Inc.

USA . 258 parts In-Stock

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$23.380

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Corohmni

South Africa . 674 parts In-Stock

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UNI Independent Distributors

Spain . 8,179 parts In-Stock

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Continental Prestige Electronics

USA . 5,537 parts In-Stock

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Corphita

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Argo Parts USA

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Bastille Electronics

Australia . 36 parts In-Stock

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Overview

Unlock the power of innovation with NXP Semiconductors' P89V51RD2BN,112 microcontroller. Perfect for a wide range of applications, this top-of-the-line product offers unmatched quality and reliability. With its advanced technology and user-friendly design, customers can expect seamless integration and enhanced performance. Whether you're designing consumer electronics, industrial automation systems, or smart home devices, this microcontroller provides the value, benefits, and advantages you need to bring your ideas to life. Experience the difference with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of power supply options.

Address Bus Width: 16

Provides a wide addressing range for memory and peripherals.

Bit Size: 8

Suitable for handling smaller data sizes efficiently.

No. of Terminals: 40

Sufficient number of terminals for connecting various components.

Minimum Operating Temperature: 0 °C

Can operate in lower temperature environments effectively.

ROM Words: 65536

Large ROM capacity for storing program instructions.

Maximum Clock Frequency: 40 MHz

High clock frequency for fast processing capabilities.

Peripheral IC Type: MICROCONTROLLER

Designed for controlling external devices and peripherals.

RAM Bytes: 1024

Sufficient RAM capacity for storing temporary data during operation.

Technical Specifications

Microcontrollers P89V51RD2BN,112 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

R-PDIP-T40

JESD-609 Code:

e3

Length:

52 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

32

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

4.7 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

P89V51RD2BN,112 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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