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P89V51RC2FA,512

NXP Semiconductors

P89V51RC2FA,512 by NXP Semiconductors

P89V51RC2FA,512 by NXP Semiconductors is an 8051 microcontroller with 8-bit CPU, 16-bit address bus, and 40 MHz clock frequency. It features 32 I/O lines, FLASH ROM programmability, and PWM channels. Ideal for industrial applications requiring a max supply voltage of 5.5 V and operating temperature range from -40 to 85°C.

Median Price

$4.420

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 109,344 parts In-Stock

1+ parts

-

100+ parts

$4.420

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109,344

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$4.420

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Rochester

USA . 95,460 parts In-Stock

1+ parts

-

100+ parts

$3.810

1k+ parts

$3.410

10k+ parts

$3.210

95,460

-

$3.810

$3.410

$3.210

Verical

USA . 53,521 parts In-Stock

1+ parts

-

100+ parts

$4.763

1k+ parts

$4.263

10k+ parts

$4.013

53,521

-

$4.763

$4.263

$4.013

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$3.853

100+ parts

-

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300

$3.853

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Digiode

USA . 4,124 parts In-Stock

1+ parts

$4.038

100+ parts

-

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4,124

$4.038

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Vyrian

USA . 92,705 parts In-Stock

1+ parts

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92,705

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Anansix

USA . 1,061 parts In-Stock

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1,061

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ACDS - Activité Composants Distribution Service

France . 158 parts In-Stock

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158

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Distributors (Availability)

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Ampacity Inc.

Singapore . 91,880 parts In-Stock

1+ parts

$3.610

100+ parts

-

1k+ parts

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91,880

$3.610

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Corphita

USA . 3,110 parts In-Stock

1+ parts

$3.825

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3,110

$3.825

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.853

100+ parts

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2,000

$3.853

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Microchip USA

USA . 338 parts In-Stock

1+ parts

$6.100

100+ parts

$6.100

1k+ parts

$6.100

10k+ parts

$6.100

338

$6.100

$6.100

$6.100

$6.100

Continental Prestige Electronics

USA . 114,951 parts In-Stock

1+ parts

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114,951

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UNI Independent Distributors

Spain . 4,436 parts In-Stock

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4,436

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Overview

Looking to power up your next project? Look no further than the P89V51RC2FA,512 from NXP Semiconductors. This high-quality microcontroller offers unmatched reliability and performance in a wide range of applications. With its advanced features and cutting-edge technology, this chip will take your designs to the next level. Trust NXP Semiconductors to deliver top-notch products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the microcontroller, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in different power supply configurations.

Address Bus Width: 16

A 16-bit address bus allows for accessing a larger memory space, enabling more complex programs and applications.

Package Shape: SQUARE

Square package shape ensures easy handling and placement on the circuit board, optimizing space utilization.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost, suitable for a wide range of applications.

Power Supplies (V): 5

Operates at a standard voltage of 5V, compatible with many electronic systems and components.

No. of Terminals: 44

With 44 terminals, the microcontroller can support a variety of input/output connections, enhancing its versatility.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers a compact and robust form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Supports a minimum supply voltage of 4.5V, ensuring reliable operation even in low-power conditions.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, suitable for industrial environments with demanding conditions.

CPU Family: 8051

Based on the 8051 CPU family, known for its reliability, compatibility, and widespread use in embedded systems.

Minimum Operating Temperature: -40 °C

Can withstand extremely low temperatures down to -40°C, making it suitable for outdoor or harsh environments.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connection to the circuit board, ensuring reliable electrical contact.

ROM Words: 32768

With 32768 ROM words, the microcontroller can store a large amount of program instructions, enabling complex functionalities.

Maximum Seated Height: 4.57 mm

Low-profile design with a maximum seated height of 4.57mm saves space and allows for compact device designs.

Width: 16.585 mm

Compact width of 16.585mm facilitates easy placement on the circuit board and efficient use of space.

External Data Bus Width: 8

An 8-bit external data bus allows for efficient data transfer and processing, enhancing overall system performance.

Maximum Clock Frequency: 40 MHz

Supports a maximum clock frequency of 40 MHz, enabling high-speed processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the microcontroller can withstand soldering processes without thermal damage.

Peak Reflow Temperature °C: 245

Capable of withstanding peak reflow temperatures up to 245°C, ensuring reliable solder joints during manufacturing.

Length: 16.585 mm

Compact length of 16.585mm allows for space-efficient placement on the circuit board, optimizing layout design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions, suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various peripheral functions integrated, it simplifies the design and development of embedded systems.

RAM Bytes: 1024

Offers 1024 bytes of RAM for data storage and processing, enabling efficient multitasking and data manipulation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the microcontroller.

Terminal Form: J BEND

J-bend terminal form facilitates easy soldering and connection to the circuit board, ensuring reliable and secure electrical connections.

Maximum Supply Current: 50 mA

Low maximum supply current of 50mA helps in minimizing power consumption and heat dissipation, ideal for battery-operated devices.

Nominal Supply Voltage: 5 V

5V nominal supply voltage offers compatibility with standard power sources and facilitates easy integration into existing systems.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) channels for precise control of analog devices, enabling accurate system regulation and motor control.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible updating of firmware or software, ensuring future-proof operation and easy maintenance.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, the microcontroller facilitates easy soldering and connection to the circuit board, reducing assembly time and effort.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the microcontroller can withstand a moderate level of moisture exposure during storage and manufacturing processes.

Speed: 40 rpm

Operating at a speed of 40 rpm, the microcontroller can execute instructions and process data efficiently, contributing to overall system performance.

No. of I/O Lines: 32

With 32 I/O lines, the microcontroller offers ample connectivity options for interfacing with external sensors, actuators, and peripherals, enhancing versatility and functionality.

Technical Specifications

Microcontrollers P89V51RC2FA,512 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

Length:

16.585 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

4.57 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Peripheral IC Type:

Trade Compliance

P89V51RC2FA,512 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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