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P89V51RD2FBC

NXP Semiconductors

P89V51RD2FBC by NXP Semiconductors

P89V51RD2FBC by NXP Semiconductors is an 8051 microcontroller with 8-bit CPU, 16-bit address bus, and 40 MHz clock frequency. It features 1024 bytes of RAM, FLASH ROM programmability, and PWM channels. Ideal for industrial applications requiring a max supply voltage of 5.5 V and operating temperature range from -40 to 85°C.

Median Price

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Lifecycle Status

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9

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1k+

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Chip Stock

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Digiode

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Anansix

USA . 2,682 parts In-Stock

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Vyrian

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LWI Electronics Inc

India . 78 parts In-Stock

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Nova Conductors

Japan . 62 parts In-Stock

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Infinite Electronics LLP

India . 50 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 6 parts In-Stock

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Rebound Electronics

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AZTECH Wire

Italy . 469 parts In-Stock

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Ampacity Inc.

Singapore . 1,573 parts In-Stock

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One Stop Electronics

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Aranea Global

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Overview

Experience next-level performance and efficiency with the P89V51RD2FBC microcontroller from NXP Semiconductors. As a leader in cutting-edge technology, NXP delivers high-quality products that redefine innovation. This versatile microcontroller is perfect for a wide range of applications, providing customers with unparalleled value and benefits. Whether you're looking to streamline your operations or enhance product functionality, the P89V51RD2FBC is the solution you've been searching for. Upgrade your experience today and unlock endless possibilities with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options and compatibility with a wide range of applications.

Address Bus Width: 16

Supports larger memory addressing capabilities, enabling the microcontroller to handle more complex tasks and data.

Package Shape: SQUARE

Space-efficient design that makes it easier to integrate into compact electronic devices.

Bit Size: 8

Suitable for handling moderate complexity tasks and data processing efficiently.

Power Supplies (V): 5

Standard voltage level that is commonly used and readily available in most electronic systems.

No. of Terminals: 44

Provides ample connectivity options for interfacing with external components and peripherals.

Minimum Supply Voltage: 4.5 V

Ensures stable operation even under lower voltage conditions, improving reliability.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial and automotive applications.

CPU Family: 8051

Well-established and widely supported CPU architecture with a proven track record of reliability and performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it suitable for a variety of environments.

ROM Words: 65536

Large memory capacity for storing program instructions and data, accommodating complex algorithms.

Maximum Seated Height: 1.2 mm

Low profile design that saves space and allows for compact product designs.

External Data Bus Width: 8

Efficient data transfer capabilities that support a wide range of data processing tasks.

Maximum Clock Frequency: 40 MHz

High-speed processing capabilities for quick execution of tasks and improved performance.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for embedded system applications, providing integrated peripherals for added functionality.

RAM Bytes: 1024

Sufficient memory for temporary data storage, facilitating smooth operation of programs and applications.

Technology: CMOS

Low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Terminal Form: GULL WING

Ease of soldering and rework, simplifying the manufacturing and maintenance processes.

Maximum Supply Current: 50 mA

Efficient power consumption that helps minimize energy costs and thermal issues.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of analog signals, suitable for motor control and power management applications.

ROM Programmability: FLASH

Allows for reprogramming of the ROM memory, enabling flexibility in updating firmware and applications.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage, ensuring reliability in humid or wet environments.

No. of I/O Lines: 32

Sufficient input/output options for connecting to external devices and sensors, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers P89V51RD2FBC attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

P89V51RD2FBC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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