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P89LPC922FDH,529

NXP Semiconductors

P89LPC922FDH,529 by NXP Semiconductors

NXP Semiconductors' P89LPC922FDH,529 is an 8-bit microcontroller with a clock frequency of 18 MHz. It features 18 I/O lines, PWM channels, and flash ROM programmability. Ideal for industrial applications requiring a small outline package with dual terminals and a temperature range of -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 4,808 parts In-Stock

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Vyrian

USA . 3,967 parts In-Stock

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Anansix

USA . 1,584 parts In-Stock

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Nova Conductors

Japan . 38 parts In-Stock

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AZTECH Wire

Italy . 767 parts In-Stock

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$10.419

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One Stop Electronics

USA . 848 parts In-Stock

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$14.000

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Ampacity Inc.

Singapore . 191 parts In-Stock

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Microchip USA

USA . 462 parts In-Stock

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Aztec Data Supply Inc.

USA . 57 parts In-Stock

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$63.210

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Corohmni

South Africa . 17 parts In-Stock

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$86.428

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Continental Prestige Electronics

USA . 5,682 parts In-Stock

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UNI Independent Distributors

Spain . 5,117 parts In-Stock

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Corphita

USA . 3,543 parts In-Stock

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Argo Parts USA

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Aranea Global

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Overview

Unlock endless possibilities with the P89LPC922FDH,529 by NXP Semiconductors. This top-notch microcontroller offers unparalleled quality and reliability, backed by the reputable manufacturer's expertise. Ideal for a wide range of applications, this product delivers exceptional value through its cutting-edge technology and versatile capabilities. Experience seamless performance, enhanced functionality, and unmatched efficiency with the P89LPC922FDH,529 - your ultimate solution for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability to the microcontroller, ensuring it can withstand various environmental conditions.

Bit Size: 8

An 8-bit microcontroller offers a good balance between performance and cost, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this microcontroller can be used in industrial applications that require reliable performance in harsh conditions.

Maximum Clock Frequency: 18 MHz

The high clock frequency allows for fast processing of data and instructions, making the microcontroller suitable for applications that require quick response times.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, enabling flexibility in updating firmware or software as needed.

Technical Specifications

Microcontrollers P89LPC922FDH,529 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

OPERATES AT 2.4V MINIMUM SUPPLY @ 12 MHZ

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

18 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

No. of I/O Lines:

18

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

18 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

P89LPC922FDH,529 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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