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P89LPC904FN

NXP Semiconductors

P89LPC904FN by NXP Semiconductors

P89LPC904FN by NXP is an 8-bit microcontroller ideal for industrial applications, featuring a -40 °C to 85 °C temp range. It offers 1024 words of FLASH ROM and 128 bytes of RAM, with a max supply current of 15 mA at 2.5/3.3V. Its dual terminal design ensures reliable performance in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,890 parts In-Stock

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Anansix

USA . 2,839 parts In-Stock

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Digiode

USA . 88 parts In-Stock

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One Stop Electronics

USA . 418 parts In-Stock

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$31.000

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UNI Independent Distributors

Spain . 4,358 parts In-Stock

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Corphita

USA . 2,911 parts In-Stock

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Kepictronics

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Overview

Unlock the potential of your next project with the P89LPC904FN microcontroller from NXP Semiconductors. Renowned for their exceptional quality, NXP empowers innovators with reliable performance and cutting-edge technology. This versatile 8-bit MCU excels in industrial applications, offering outstanding durability in extreme temperatures. Experience faster development cycles and improved efficiency, ensuring your designs stand out in today's competitive landscape. Elevate your solutions with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides a lightweight and durable solution, enhancing the microcontroller's reliability.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space usage on printed circuit boards (PCBs), making it suitable for compact designs.

Bit Size: 8

An 8-bit architecture offers simplicity and cost-effectiveness for less demanding applications, making it a great choice for basic control tasks.

Power Supplies (V): 2.5/3.3

Operating at low voltage ranges like 2.5V and 3.3V improves energy efficiency and is ideal for battery-powered applications.

No. of Terminals: 8

The 8 terminals make it easy to interface with various peripherals while maintaining a compact footprint.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy integration with breadboards and PCBs, enhancing prototyping flexibility.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures stable performance in moderate industrial environments.

CPU Family: 8051

Being part of the widely used 8051 family, this microcontroller benefits from extensive community support and numerous resources.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this microcontroller suitable for harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and protects against corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for better layout flexibility and ease of routing on PCBs.

ROM Words: 1024

With 1024 ROM words, this microcontroller provides sufficient program memory for a variety of applications.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this microcontroller is robust enough for demanding applications.

RAM Bytes: 128

The presence of 128 bytes of RAM supports efficient data processing for small, resource-constrained applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it a reliable choice for embedded systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide mechanical strength for better durability in tougher applications.

Maximum Supply Current: 15 mA

The low maximum supply current of 15 mA contributes to overall energy efficiency, particularly important for portable devices.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming and updates, enhancing development flexibility.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is standard, ensuring compatibility with commonly used sockets and PCBs.

Speed: 18 rpm

Operating at 18 rpm provides sufficient speed for many applications without overheating the device.

Technical Specifications

Microcontrollers P89LPC904FN attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

1024

ROM Programmability:

FLASH

Speed:

18 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

P89LPC904FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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