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P89LPC922FDH,112

NXP Semiconductors

P89LPC922FDH,112 by NXP Semiconductors

NXP Semiconductors' P89LPC922FDH,112 is an 8-bit microcontroller with 18 I/O lines and PWM channels. It features FLASH ROM programmability and operates on CMOS technology. This small outline package with a 0.65 mm terminal pitch is ideal for compact electronic applications requiring precise control and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 4,897 parts In-Stock

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Anansix

USA . 1,940 parts In-Stock

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Vyrian

USA . 1,624 parts In-Stock

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Nova Conductors

Japan . 80 parts In-Stock

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Ampacity Inc.

Singapore . 1,213 parts In-Stock

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$13.000

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One Stop Electronics

USA . 1,099 parts In-Stock

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$16.000

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AZTECH Wire

Italy . 811 parts In-Stock

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$16.083

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Aztec Data Supply Inc.

USA . 4,035 parts In-Stock

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$25.260

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Corohmni

South Africa . 381 parts In-Stock

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$50.957

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Corphita

USA . 3,711 parts In-Stock

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Argo Parts USA

USA . 2,953 parts In-Stock

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UNI Independent Distributors

Spain . 908 parts In-Stock

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Continental Prestige Electronics

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Aranea Global

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Overview

Unlock the power of innovation with the P89LPC922FDH,112 microcontroller from NXP Semiconductors. Designed with precision and reliability in mind, this compact yet powerful device offers endless possibilities for applications in various industries. With its advanced technology and versatile features, this microcontroller ensures optimal performance and seamless integration. Revolutionize your projects and elevate your creations with the unparalleled quality and value that the P89LPC922FDH,112 brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for compact design and easy assembly, making the product suitable for space-constrained applications.

Bit Size: 8

With an 8-bit size, this microcontroller is suitable for applications that require moderate computational power.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and thin profile of the package allows for efficient use of space on a circuit board.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

ROM Programmability: FLASH

Flash programmable ROM provides flexibility for firmware updates without requiring special equipment, making the product versatile and easy to maintain.

Technical Specifications

Microcontrollers P89LPC922FDH,112 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

OPERATES AT 2.4V MINIMUM SUPPLY @ 12 MHZ

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of I/O Lines:

18

No. of Terminals:

20

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

P89LPC922FDH,112 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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