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P89LPC936FDH,518

NXP Semiconductors

P89LPC936FDH,518 by NXP Semiconductors

The NXP Semiconductors P89LPC936FDH,518 is an 8-bit microcontroller with a max clock frequency of 12 MHz. It features 768 bytes of RAM and 16384 ROM words, suitable for industrial applications. With ADC and DAC channels, this CMOS technology-based MCU operates b/w -40 to 85°C temperature range.

Median Price

$2.735

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

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Vyrian

USA . 8,824 parts In-Stock

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Digiode

USA . 3,568 parts In-Stock

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Anansix

USA . 1,530 parts In-Stock

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Argo Parts USA

USA . 3,039 parts In-Stock

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Continental Prestige Electronics

USA . 2,843 parts In-Stock

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$2.680

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Netroflash

USA . 50 parts In-Stock

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AZTECH Wire

Italy . 624 parts In-Stock

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$8.448

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One Stop Electronics

USA . 355 parts In-Stock

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$12.000

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Vigor

Singapore . 100 parts In-Stock

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$15.000

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Ampacity Inc.

Singapore . 1,461 parts In-Stock

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$27.000

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Microchip USA

USA . 410 parts In-Stock

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Modulus Dynamics

Lithuania . 44 parts In-Stock

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$53.095

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Corohmni

South Africa . 873 parts In-Stock

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$75.086

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UNI Independent Distributors

Spain . 8,205 parts In-Stock

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Corphita

USA . 1,650 parts In-Stock

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Benley Electronics

USA . 110 parts In-Stock

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Overview

Unlock the power of innovation with the NXP Semiconductors P89LPC936FDH,518 microcontroller. Designed with precision and reliability in mind, this versatile device offers endless possibilities for your projects. Whether you're working on IoT devices, industrial automation, or consumer electronics, this microcontroller's advanced features, such as ADC and DAC channels, 8-bit processing, and flash ROM programmability, will elevate your creations to new heights. Experience seamless performance and efficiency with the P89LPC936FDH,518 - the perfect choice for forward-thinking engineers and designers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

This feature allows for easy and secure mounting on circuit boards, making installation and assembly hassle-free.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate into different electronic designs, providing flexibility in layout arrangements.

Bit Size: 8

The 8-bit architecture offers a balance between performance and cost-effectiveness, making it a reliable choice for many projects.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to produce analog output signals with precision, expanding its functionality.

Power Supplies (V): 2.5/3.3

This range of power supply options allows for compatibility with various voltage sources, increasing the usability of the microcontroller.

No. of Terminals: 28

With a generous number of terminals, this microcontroller provides ample connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact and space-saving package style makes it ideal for applications with limited space constraints.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures energy efficiency and reliable operation even under lower power conditions.

Technical Specifications

Microcontrollers P89LPC936FDH,518 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

12 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

26

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

768

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

23 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

P89LPC936FDH,518 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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