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P89LPC9221FDH,518

NXP Semiconductors

P89LPC9221FDH,518 by NXP Semiconductors

P89LPC9221FDH,518 from NXP Semiconductors is an 8-bit microcontroller ideal for industrial applications. It features a wide operating temp range (-40 °C to 85 °C), 8192 ROM words, and operates at 2.5/3.3V with a max current of 15mA. Its compact design ensures efficient surface mounting in various projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,908 parts In-Stock

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Anansix

USA . 2,872 parts In-Stock

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Digiode

USA . 2,784 parts In-Stock

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Microchip USA

USA . 433 parts In-Stock

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$2.737

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One Stop Electronics

USA . 251 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 719 parts In-Stock

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$15.050

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Component Stockers USA

USA . 452 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 14,944 parts In-Stock

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Corphita

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UNI Independent Distributors

Spain . 1,350 parts In-Stock

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Overview

Unlock unparalleled performance with the P89LPC9221FDH,518 microcontroller from NXP Semiconductors. Renowned for their innovation and quality, NXP delivers a robust solution perfect for industrial applications, ensuring reliability in even the most demanding environments. With its compact design and efficient power consumption, this microcontroller empowers your projects to achieve remarkable efficiency and longevity, providing exceptional value and peace of mind for developers and engineers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the product's resilience and longevity, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, saving space on PCBs and enabling efficient manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape provides design flexibility, allowing easier integration into various electronic systems.

Bit Size: 8

An 8-bit architecture offers a good balance of processing capability and power efficiency for many applications.

Power Supplies (V): 2.5/3.3

Operating at lower voltages ensures energy efficiency, extending battery life in portable applications.

No. of Terminals: 20

The 20-terminal configuration provides sufficient I/O options for comprehensive interfacing without overcrowding.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This small and thin package style facilitates high-density PCB designs and is ideal for applications where space is a premium.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in high-temperature environments, suitable for industrial applications.

CPU Family: 8051

The 8051 CPU family is well-established and supported, providing extensive resources, libraries, and development tools.

Minimum Operating Temperature: -40 °C

The -40 °C minimum operating temperature allows for use in extreme conditions, making it suitable for a variety of outdoor and industrial applications.

Terminal Position: DUAL

Dual terminal positions facilitate easy soldering and efficient layout during PCB assembly.

ROM Words: 8192

With 8192 ROM words, the device offers ample memory for application code, enabling complex functionality without memory constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robustness and reliability, ideal for critical applications in fluctuating temperature environments.

RAM Bytes: 256

256 bytes of RAM allow for effective data processing and temporary storage for lightweight applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this microcontroller energy efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals facilitate easy mounting and are widely compatible with standard soldering techniques.

Maximum Supply Current: 15 mA

A maximum supply current of 15 mA indicates low power consumption, making it suitable for battery-powered applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, enhancing flexibility and adaptability.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm aids in space-efficient PCB layout while allowing for reliable connections.

Speed: 12 rpm

Operating at a speed of 12 rpm is sufficient for handling various control tasks, making it suitable for moderate-speed applications.

Technical Specifications

Microcontrollers P89LPC9221FDH,518 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

R-PDSO-G20

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

P89LPC9221FDH,518 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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