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P89LPC9161FDH,129

NXP Semiconductors

P89LPC9161FDH,129 by NXP Semiconductors

Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,362 parts In-Stock

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4,362

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Vyrian

USA . 3,261 parts In-Stock

1+ parts

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3,261

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Anansix

USA . 984 parts In-Stock

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984

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 444 parts In-Stock

1+ parts

$2.650

100+ parts

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444

$2.650

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One Stop Electronics

USA . 140 parts In-Stock

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$13.000

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140

$13.000

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AZTECH Wire

Italy . 108 parts In-Stock

1+ parts

$14.150

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108

$14.150

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QUARKTWIN TECHNOLOGY LTD

USA . 5,629 parts In-Stock

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5,629

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Corphita

USA . 3,961 parts In-Stock

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3,961

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UNI Independent Distributors

Spain . 2,869 parts In-Stock

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2,869

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Technical Specifications

Microcontrollers P89LPC9161FDH,129 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

2048

ROM Programmability:

FLASH

Speed:

18 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

23 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

P89LPC9161FDH,129 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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