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P4040NSE7MMC

NXP Semiconductors

P4040NSE7MMC by NXP Semiconductors

The NXP Semiconductors P4040NSE7MMC microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. With a max clock frequency of 133.3 MHz, it is suitable for applications requiring high-speed processing such as networking equipment and industrial control systems. The package style is grid array with heat sink/slug, making it ideal for surface mount assembly in compact electronic devices.

Median Price

$384.360

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 136 parts In-Stock

1+ parts

$384.360

100+ parts

$361.300

1k+ parts

$338.240

10k+ parts

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136

$384.360

$361.300

$338.240

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Distributors (In-Stock)

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Digiode

USA . 451 parts In-Stock

1+ parts

$368.686

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451

$368.686

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Flip Electronics

USA . 11,543 parts In-Stock

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11,543

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Anansix

USA . 2,443 parts In-Stock

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2,443

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Vyrian

USA . 2,244 parts In-Stock

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2,244

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Bristol Electronics

USA . 315 parts In-Stock

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315

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Nova Conductors

Japan . 25 parts In-Stock

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25

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Distributors (Availability)

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Corohmni

South Africa . 40 parts In-Stock

1+ parts

$66.881

100+ parts

-

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40

$66.881

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AZTECH Wire

Italy . 2,244 parts In-Stock

1+ parts

$264.470

100+ parts

$254.000

1k+ parts

$248.920

10k+ parts

$243.940

2,244

$264.470

$254.000

$248.920

$243.940

One Stop Electronics

USA . 100 parts In-Stock

1+ parts

$329.880

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100

$329.880

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Ampacity Inc.

Singapore . 100 parts In-Stock

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$329.880

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100

$329.880

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Microchip USA

USA . 1,808 parts In-Stock

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$342.490

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1,808

$342.490

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Corphita

USA . 506 parts In-Stock

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$349.281

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506

$349.281

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Vigor

Singapore . 599 parts In-Stock

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$698.560

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599

$698.560

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A-Z Elektronik GmbH

Germany . 5,130 parts In-Stock

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UNI Independent Distributors

Spain . 4,948 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Continental Prestige Electronics

USA . 2,450 parts In-Stock

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2,450

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Argo Parts USA

USA . 2,296 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 35 parts In-Stock

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35

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Overview

Discover the power and efficiency of the NXP Semiconductors P4040NSE7MMC microprocessor. With cutting-edge technology and a reputation for quality, NXP delivers a top-of-the-line product that is perfect for a wide range of applications. Whether you're looking to enhance your computing performance or streamline your industrial processes, this microprocessor offers unparalleled value, benefits, and advantages. Trust NXP to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the microprocessor.

Integrated Cache: YES

Having integrated cache improves the overall performance and speed of the microprocessor.

Surface Mount: YES

Being surface mountable makes it easier and more convenient to integrate into various circuit boards and devices.

Maximum Supply Voltage: 1.05 V

With a maximum supply voltage of 1.05V, the microprocessor can operate efficiently within safe voltage limits.

Address Bus Width: 16

A wider address bus width allows for more efficient data transfer and processing.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design for easy installation.

Bit Size: 32

A 32-bit size allows for faster data processing and performance capabilities.

No. of Terminals: 1295

A high number of terminals enable versatile connectivity and integration with other components.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style with heat sink/slug allows for effective heat dissipation, ensuring optimal performance under high loads.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage of 0.95V helps in reducing power consumption and heat generation.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

The bottom terminal position is convenient for mounting and connecting the microprocessor in circuit boards.

Maximum Seated Height: 3.53 mm

The maximum seated height of 3.53mm allows for compatibility with various enclosures and systems.

Width: 37.5 mm

The width of 37.5mm offers a compact form factor for easy integration in tight spaces.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microprocessor during production.

External Data Bus Width: 64

A wider external data bus width of 64 bits enables faster data transfer rates and higher bandwidth.

Maximum Clock Frequency: 133.3 MHz

The high maximum clock frequency of 133.3 MHz provides fast processing speeds for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C allows for reliable solder connections without compromising component integrity.

Length: 37.5 mm

The length of 37.5mm complements the compact width for a space-efficient design.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with Reduced Instruction Set Computing (RISC) architecture enables efficient and streamlined processing.

Technology: CMOS

The CMOS technology used in the microprocessor ensures low power consumption and high performance.

Terminal Form: BALL

The ball terminal form provides reliable connections and efficient heat dissipation for enhanced performance.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V ensures stable and consistent power delivery to the microprocessor.

Terminal Pitch: 1 mm

The 1mm terminal pitch facilitates easy mounting and soldering of the microprocessor on circuit boards.

Format: FIXED POINT

Being a fixed-point format microprocessor allows for precise and accurate arithmetic calculations.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microprocessor can withstand standard assembly and storage conditions.

Speed: 1200 rpm

The rotational speed of 1200 rpm ensures efficient cooling and thermal management for the microprocessor.

Low Power Mode: YES

The low power mode feature helps in reducing energy consumption and heat generation when the microprocessor is not operating at full capacity.

Technical Specifications

Microprocessors P4040NSE7MMC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

133.3 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1295

JESD-609 Code:

e1

Length:

37.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1295,36X36,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

Maximum Seated Height:

3.53 mm

Speed:

1200 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

37.5 mm

Peripheral IC Type:

Trade Compliance

P4040NSE7MMC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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