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NX3L4053HR,115

NXP Semiconductors

NX3L4053HR,115 by NXP Semiconductors

NX3L4053HR,115 from NXP Semiconductors is a CMOS SPDT multiplexer with a max on-state resistance of 4.2Ω and operates b/w -40 °C to 125 °C. It features 16 terminals in a no-lead chip carrier package, ideal for automotive applications. With separate outputs and fast switching (90 ns), it ensures reliable performance in compact designs.

Median Price

$0.719

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 29,067 parts In-Stock

1+ parts

$0.453

100+ parts

$0.261

1k+ parts

$0.246

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29,067

$0.453

$0.261

$0.246

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Rochester

USA . 28,091 parts In-Stock

1+ parts

-

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$0.706

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$0.586

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$0.522

28,091

-

$0.706

$0.586

$0.522

DigiKey

USA . 28,091 parts In-Stock

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$0.880

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28,091

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-

$0.880

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Verical

USA . 27,682 parts In-Stock

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$0.732

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$0.653

27,682

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$0.732

$0.653

Distributors (In-Stock)

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Digiode

USA . 215 parts In-Stock

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$0.430

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215

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Rebound Electronics

UK . 20,464 parts In-Stock

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Flip Electronics

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Vyrian

USA . 7,113 parts In-Stock

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Anansix

USA . 941 parts In-Stock

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Corphita

USA . 4,169 parts In-Stock

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$0.408

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$0.408

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Continental Prestige Electronics

USA . 29,566 parts In-Stock

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$0.453

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$0.261

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29,566

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$0.261

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$1.332

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$1.212

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$1.092

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10

$1.332

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$1.092

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Microchip USA

USA . 914 parts In-Stock

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$1.640

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AZTECH Wire

Italy . 671 parts In-Stock

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$17.140

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Overview

Unlock unparalleled performance with the NX3L4053HR,115 from NXP Semiconductors. Renowned for their commitment to innovation and quality, NXP delivers a multiplexer that excels in automotive applications, ensuring reliability even in extreme conditions. With its efficient design and low on-state resistance, this switch optimizes power usage while enhancing signal integrity. Choose the NX3L4053HR,115 for cutting-edge technology that drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against moisture and environmental factors.

Surface Mount: YES

Surface mount technology allows for a compact design, making it suitable for high-density PCB layouts.

No. of Functions: 3

Having multiple functions in one device enhances versatility and reduces the need for additional components.

Package Shape: SQUARE

The square package shape facilitates efficient space utilization on the PCB.

Power Supplies (V): 1.4/4.3

Wide operating voltage range enables compatibility with various systems, making it flexible for different applications.

No. of Terminals: 16

A higher number of terminals allows for more connections, increasing the device's utility in complex circuits.

Package Style (Meter): CHIP CARRIER

The chip carrier style provides easy integration with standard PCB features and simplifies assembly.

Maximum Operating Temperature: 125 °C

With a high operating temperature, this product is suitable for use in demanding environments.

Minimum Operating Temperature: -40 °C

The extended low-temperature range ensures reliable performance in extremely cold conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin terminals improve solderability and prevent corrosion, ensuring reliable connections over time.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing of signals and easier connectivity on PCBs.

Output (V): SEPARATE OUTPUT

Separate outputs enhance functionality by allowing independent control over different circuit paths.

Other IC type: SPDT

Single Pole Double Throw (SPDT) configuration is ideal for versatile switching applications.

Maximum Time At Peak Reflow Temperature: 30s

Optimized reflow time increases the reliability of solder joints during assembly.

Peak Reflow Temperature: 260 °C

High peak reflow temperature capability accommodates various soldering processes for diverse applications.

Maximum On-state Resistance (Ron): 4.2 ohm

Low on-state resistance ensures efficient power transfer and minimizes heat generation during operation.

Maximum Switch-on Time: 90 ns

Fast switch-on time contributes to better performance in high-speed applications.

Temperature Grade: AUTOMOTIVE

Automotive grade components guarantee reliability and performance in vehicle applications, meeting strict industry standards.

Technology: CMOS

CMOS technology offers low power consumption, making it energy-efficient and suitable for battery-operated devices.

Terminal Form: NO LEAD

No lead design reduces the environmental impact and allows for a thinner profile.

Terminal Pitch: 0.5 mm

Small terminal pitch enables compact layouts, supporting high-density applications.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching strategy prevents short circuits, enhancing circuit reliability.

Technical Specifications

Multiplexers & Switches NX3L4053HR,115 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

16

Maximum On-state Resistance (Ron):

4.2 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

90 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NX3L4053HR,115 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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