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NX3L2T384GT,115

NXP Semiconductors

NX3L2T384GT,115 by NXP Semiconductors

NX3L2T384GT,115 by NXP Semiconductors is a CMOS SPDT switch ideal for automotive applications. It operates b/w 1.4V and 4.3V with a max on-state resistance of 1.7Ω and offers excellent isolation at 90 dB. Its compact design features an ultra-thin profile suitable for space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,929 parts In-Stock

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Digiode

USA . 2,007 parts In-Stock

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Anansix

USA . 1,187 parts In-Stock

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One Stop Electronics

USA . 175 parts In-Stock

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$5.500

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AZTECH Wire

Italy . 152 parts In-Stock

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$10.940

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Advanced Electronics

New Zealand . 61 parts In-Stock

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$11.551

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$10.511

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$9.472

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Microchip USA

USA . 103 parts In-Stock

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$12.300

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UNI Independent Distributors

Spain . 3,925 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Unlock unparalleled performance with the NX3L2T384GT,115 from NXP Semiconductors—a leader in innovative semiconductor solutions. This versatile multiplexer seamlessly integrates into diverse applications, delivering exceptional reliability in automotive and consumer electronics. Experience reduced power consumption and swift signal switching, all wrapped in a compact design. Elevate your projects with this high-quality component that promises durability and precision, ensuring you stay ahead in today's competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures good durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and automated manufacturing, leading to reduced assembly costs and improved performance.

No. of Functions: 2

Offering two functions allows flexibility in application, enabling designers to utilize the device in multiple roles within a circuit.

Package Shape: RECTANGULAR

The rectangular shape is optimal for space-saving layouts on PCBs, facilitating efficient use of available board area.

Nominal Supply Voltage (Vsup): 1.65 V

A low nominal supply voltage increases efficiency and allows for compatibility with low-power applications.

Power Supplies (V): 1.4/4.3

The wide range of power supply voltage ensures versatility in various electronic designs, catering to diverse system requirements.

No. of Terminals: 8

With eight terminals, this device can accommodate complex circuit configurations, enhancing its application in advanced systems.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile make it suitable for compact electronic devices where space is at a premium.

Maximum Operating Temperature: 125 °C

Ability to withstand high temperatures ensures reliability and performance in harsh environments, suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The product's performance in low temperatures expands its suitability for use in extreme conditions relevant for automotive and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent corrosion resistance and reliable electrical performance, ensuring long-term durability.

Terminal Position: DUAL

Dual terminal positions enhance connectivity options for layout flexibility in PCB design.

Maximum Seated Height: 0.5 mm

The minimal seated height ensures compatibility with low-profile designs, which is critical for modern compact electronics.

Width: 1 mm

A narrow width allows for more efficient board layout and maximization of available space.

Other IC type: SPDT

The Single-Pole Double-Throw configuration offers versatile switching options, enabling seamless signal path routing.

Minimum Supply Voltage (Vsup): 1.4 V

The low minimum supply voltage facilitates the integration in low power systems, optimizing energy consumption.

Maximum Time At Peak Reflow Temperature (s): 30

A sweet spot for peak reflow time prevents damage to components during the manufacturing process, ensuring integrity.

Peak Reflow Temperature (°C): 260

High reflow temperature tolerance indicates compatibility with advanced soldering techniques, vital for modern manufacturing.

Maximum On-state Resistance (Ron): 1.7 ohm

Low on-state resistance minimizes power loss during operation, which is crucial for energy-efficient designs.

Maximum Switch-on Time: 120 ns

Fast switch-on time ensures high-speed performance, making it suitable for high-frequency applications.

Length: 1.95 mm

A compact length ensures efficient space utilization on PCBs, crucial in modern electronics.

Maximum Switch-off Time: 60 ns

Quick switch-off time contributes to effective signal switching, enhancing overall circuit performance.

Temperature Grade: AUTOMOTIVE

Automotive grade ensures that this product meets strict reliability and durability criteria for use in vehicle applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving overall system efficiency.

Terminal Form: NO LEAD

No-lead terminals enable a more compact package size, ideal for high-density PCB designs.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for tight packing of components, maximizing the utilization of PCB space.

Maximum Supply Voltage (Vsup): 4.3 V

The maximum supply voltage supports a wide range of applications, suitable for various electronic designs.

Nominal Off-state Isolation: 90 dB

High off-state isolation ensures minimal signal interference, providing clearer audio and data signals.

Nominal On-state Resistance Match: 0.04 ohm

Excellent matching of on-state resistance contributes to consistent performance across multiple devices.

Technical Specifications

Multiplexers & Switches NX3L2T384GT,115 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.95 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

8

Nominal Off-state Isolation:

90 dB

Nominal On-state Resistance Match:

.04 ohm

Maximum On-state Resistance (Ron):

1.7 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Maximum Switch-off Time:

60 ns

Maximum Switch-on Time:

120 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1 mm

Trade Compliance

NX3L2T384GT,115 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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