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NX3L2T384GD,125

NXP Semiconductors

NX3L2T384GD,125 by NXP Semiconductors

NX3L2T384GD,125 by NXP Semiconductors is a CMOS SPDT switch with a max operating temp of 125 °C and low on-state resistance of 1.7Ω. It operates b/w 1.4V to 4.3V, making it ideal for automotive applications. Its compact design features an ultra-thin profile and surface mount capability.

Median Price

$0.396

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 494 parts In-Stock

1+ parts

-

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$0.396

1k+ parts

$0.329

10k+ parts

$0.293

494

-

$0.396

$0.329

$0.293

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$0.290

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$0.290

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Digiode

USA . 4,606 parts In-Stock

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$0.309

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$0.309

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Vyrian

USA . 6,797 parts In-Stock

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Anansix

USA . 2,803 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 824 parts In-Stock

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$0.292

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824

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Vigor

Singapore . 3,494 parts In-Stock

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$0.310

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$0.310

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Microchip USA

USA . 231 parts In-Stock

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$4.065

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Advanced Electronics

New Zealand . 450 parts In-Stock

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$9.248

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$8.416

1k+ parts

$7.583

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450

$9.248

$8.416

$7.583

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AZTECH Wire

Italy . 135 parts In-Stock

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$15.910

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Perfect Parts

USA . 6,832 parts In-Stock

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UNI Independent Distributors

Spain . 6,588 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3,100 parts In-Stock

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Overview

Elevate your designs with the NX3L2T384GD,125 from NXP Semiconductors—a trusted leader in innovative solutions. This versatile multiplexer excels in automotive applications, delivering robust performance even in extreme conditions. Experience unparalleled reliability and swift switching speeds that enhance efficiency. With its compact, surface-mount design, it seamlessly integrates into your projects, providing exceptional value and ensuring your systems run smoothly and effectively. Choose NXP for quality you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology ensures compact size and facilitates automated assembly, which is ideal for space-constrained designs.

No. of Functions: 2

Having two functions allows for versatile applications, making it more efficient and reducing the need for multiple components.

Package Shape: RECTANGULAR

The rectangular shape offers an optimal layout for PCB design, aiding in efficient space utilization.

Nominal Supply Voltage (Vsup): 1.65 V

A low nominal supply voltage makes it compatible with a variety of low-power applications, extending battery life in portable devices.

Power Supplies (V): 1.4/4.3

Wide range of power supply voltages accommodates diverse operational conditions, enhancing flexibility in design.

No. of Terminals: 8

With 8 terminals, this product allows for multiple connections, facilitating complex circuit designs.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The thin profile is perfect for space-limited designs and modern electronics that require compact solutions.

Maximum Operating Temperature: 125 °C

High operating temperature enables the component to function reliably under harsh conditions, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Extensive temperature range ensures reliable performance in extreme conditions, which is critical for automotive and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This premium terminal finish guarantees improved conductivity and corrosion resistance, enhancing reliability and lifespan.

Terminal Position: DUAL

Dual terminal positioning aids in simplifying PCB layout and integration into various designs.

Maximum Seated Height: 0.5 mm

Very low seated height allows for more compact device designs, contributing to slimmer electronic devices.

Width: 2 mm

A narrow width is ideal for dense board layouts, facilitating use in miniaturized applications.

Other IC type: SPDT

Single Pole Double Throw configuration provides flexibility in signal routing, allowing for diverse applications.

Minimum Supply Voltage (Vsup): 1.4 V

Low minimum supply voltage enhances compatibility with various low-voltage applications, extending device usability.

Maximum Time At Peak Reflow Temperature: 30s

Short reflow time minimizes thermal stress on components, ensuring reliability in manufacturing processes.

Peak Reflow Temperature: 260 °C

High peak temperature capability allows for compatibility with lead-free assembly processes, adhering to modern manufacturing standards.

Maximum On-state Resistance (Ron): 1.7 ohm

Low on-state resistance translates to lower power loss and increased efficiency in signal transmission.

Maximum Switch-on Time: 120 ns

Fast switch-on time enables rapid signal processing, suitable for high-speed applications.

Length: 3 mm

Compact length makes it an ideal choice for space-sensitive applications, contributing to overall design efficiency.

Maximum Switch-off Time: 60 ns

Quick switch-off time enhances performance in dynamic applications, improving overall system responsiveness.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards ensures reliability and robustness against harsh automotive environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: NO LEAD

No-lead design enables better thermal performance and reduces the footprint on PCB, optimizing space further.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging, enabling more functionality in a smaller space.

Maximum Supply Voltage (Vsup): 4.3 V

Higher maximum supply voltage accommodates various high-performance applications, ensuring flexibility in design.

Nominal Off-state Isolation: 90 dB

High isolation prevents signal crosstalk, maintaining signal integrity in mixed-signal applications.

Nominal On-state Resistance Match: 0.04 ohm

Excellent resistance matching optimizes performance across multiple channels, reducing power loss and heat generation.

Technical Specifications

Multiplexers & Switches NX3L2T384GD,125 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

8

Nominal Off-state Isolation:

90 dB

Nominal On-state Resistance Match:

.04 ohm

Maximum On-state Resistance (Ron):

1.7 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Maximum Switch-off Time:

60 ns

Maximum Switch-on Time:

120 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

NX3L2T384GD,125 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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