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NX3L2467HRZ

NXP Semiconductors

NX3L2467HRZ by NXP Semiconductors

DPDT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e4;

Median Price

$0.491

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,000 parts In-Stock

1+ parts

-

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$0.491

9,000

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-

$0.491

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,044 parts In-Stock

1+ parts

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8,044

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Digiode

USA . 3,122 parts In-Stock

1+ parts

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3,122

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Martec Srl

Italy . 2,739 parts In-Stock

1+ parts

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2,739

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Bristol Electronics

USA . 2,739 parts In-Stock

1+ parts

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2,739

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Anansix

USA . 2,259 parts In-Stock

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2,259

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,922 parts In-Stock

1+ parts

$3.453

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2,922

$3.453

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AZTECH Wire

Italy . 1,134 parts In-Stock

1+ parts

$19.950

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1,134

$19.950

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UNI Independent Distributors

Spain . 6,605 parts In-Stock

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6,605

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Corphita

USA . 3,099 parts In-Stock

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3,099

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Technical Specifications

Multiplexers & Switches NX3L2467HRZ attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NX3L2467HRZ Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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