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NX3L1G66GW-Q100H

NXP Semiconductors

NX3L1G66GW-Q100H by NXP Semiconductors

NX3L1G66GW-Q100H by NXP Semiconductors is a CMOS SPST switch designed for automotive applications, featuring a max operating temp of 125 °C and low on-state resistance of 4.1Ω. It operates b/w 1.4V to 4.3V with a fast switch-on time of just 41ns. Its compact design ensures efficient surface mounting in space-constrained environments.

Median Price

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Lifecycle Status

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4

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1k+

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Flip Electronics

USA . 18,000 parts In-Stock

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Vyrian

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Anansix

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Digiode

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Microchip USA

USA . 340 parts In-Stock

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$0.268

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One Stop Electronics

USA . 879 parts In-Stock

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$5.500

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AZTECH Wire

Italy . 908 parts In-Stock

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$16.230

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Corphita

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Vigor

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Overview

Unlock unparalleled performance with the NX3L1G66GW-Q100H from NXP Semiconductors, a leader in innovative solutions. This automotive-grade SPST multiplexer not only boasts exceptional reliability and durability under extreme temperatures but is also designed for seamless integration into your electronic systems. Experience reduced power consumption and swift switching times, making it ideal for automotive applications where efficiency matters. Trust in NXP’s legacy of quality to elevate your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and reliability, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount technology enables compact PCB designs and facilitates automated assembly, reducing manufacturing costs.

Screening Level: AEC-Q100

AEC-Q100 qualification assures high quality and reliability required for automotive applications, instilling confidence in critical environments.

Package Shape: RECTANGULAR

A rectangular shape offers efficient space utilization on PCBs, ideal for small form factor designs.

Power Supplies (V): 1.4/4.3

Wide operating voltage range (1.4V to 4.3V) offers versatility for different applications, making it adaptable for various device requirements.

No. of Terminals: 5

With five terminals, this IC provides multiple pathways for signal routing, enhancing functionality within compact designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save precious space on PCBs, making it an excellent choice for space-constrained applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance in high-temperature settings, suitable for harsh automotive environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, it is designed to function effectively in extreme cold, making it a reliable choice for varied climates.

Terminal Position: DUAL

Dual terminal position allows for flexible integration in various layouts, enhancing design versatility.

Other IC type: SPST

Single Pole Single Throw (SPST) configuration is simple and effective for on-off switching, catering to basic switching applications.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C is compatible with standard soldering processes, ensuring it can be easily integrated into assembly lines.

Maximum On-state Resistance (Ron): 4.1 ohm

Low on-state resistance (4.1 ohm) minimizes power loss during operation, making it energy efficient and enhancing performance.

Maximum Switch-on Time: 41 ns

Fast switch-on time (41 ns) allows for high-speed applications, providing quick response in dynamic systems.

Temperature Grade: AUTOMOTIVE

Designed with automotive-grade specifications, this product is built to withstand the rigors of automotive applications, ensuring durability and longevity.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making it ideal for modern electronic applications.

Terminal Form: GULL WING

Gull wing terminals are designed for easier soldering and reliability in connections, enhancing the product's robustness.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch makes it compatible with various PCB designs, providing flexibility in layout configurations.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching prevents short circuits and potential damage to circuits, ensuring reliable operation.

Technical Specifications

Multiplexers & Switches NX3L1G66GW-Q100H attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G5

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Functions:

1

No. of Terminals:

5

Maximum On-state Resistance (Ron):

4.1 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

41 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

NX3L1G66GW-Q100H Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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