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NX3L1G66GW,125

NXP Semiconductors

NX3L1G66GW,125 by NXP Semiconductors

NX3L1G66GW,125 from NXP Semiconductors is a CMOS multiplexer with a max operating temp of 125 °C and low on-state resistance of 1.7Ω. It operates at supply voltages b/w 1.4V and 4.3V, making it ideal for automotive applications. Its compact design features a thin profile and surface mount capability for efficient integration.

Median Price

$0.070

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 100 parts In-Stock

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$0.070

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Digiode

USA . 4,254 parts In-Stock

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Vyrian

USA . 3,175 parts In-Stock

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Sensible Micro Corp

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Flip Electronics

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Anansix

USA . 692 parts In-Stock

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ABC Electronics Ltd.

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Contempo Components LLC

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One Stop Electronics

USA . 507 parts In-Stock

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Microchip USA

USA . 283 parts In-Stock

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AZTECH Wire

Italy . 378 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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UNI Independent Distributors

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Corphita

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Authorized Procurement Solutions

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Overview

Unlock unparalleled performance with the NX3L1G66GW,125 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a reliable solution in multiplexers and switches that enhances your designs while ensuring optimal efficiency. Ideal for automotive and industrial applications, this compact device offers exceptional speed and low power consumption, empowering you to create cutting-edge products that stand out in today’s fast-paced market. Elevate your projects with the trusted expertise of NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ensuring reliability and performance in various applications.

Surface Mount: YES

Facilitates easy integration into modern circuit boards, allowing for reduced size and improved assembly efficiency.

Package Shape: RECTANGULAR

Rectangular shape optimizes space on PCB, making it suitable for compact designs.

Nominal Supply Voltage (Vsup): 1.65 V

Low operating voltage leads to energy efficiency, contributing to longer battery life in portable devices.

Power Supplies (V): 1.5/3.3

Flexible voltage options make it compatible with a wide range of devices and applications.

No. of Terminals: 5

Sufficient number of terminals provides versatile connectivity for various circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile and small outline are ideal for space-constrained applications, enabling high-density designs.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliable performance in harsh environments, particularly in automotive applications.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in extreme conditions, making it suitable for automotive and industrial use.

Terminal Finish: TIN

Tin finish provides excellent solderability and helps enhance the overall durability of the connections.

Terminal Position: DUAL

Dual terminal positions facilitate flexible placement options on PCB, allowing for more efficient layouts.

Maximum Seated Height: 1.1 mm

Low seated height helps reduce the overall profile of the device, supporting slimmer designs.

Width: 1.25 mm

Narrow width allows for close placement with other components on the PCB, optimizing space.

Minimum Supply Voltage (Vsup): 1.4 V

Low minimum supply voltage ensures compatibility with low-voltage systems and enhances energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient production processes, minimizing thermal stress on components during assembly.

Peak Reflow Temperature °C: 260

High peak temperature compatibility ensures robustness and reliable soldering during manufacturing.

Maximum On-state Resistance (Ron): 1.7 ohm

Low on-state resistance helps in minimizing power loss, contributing to the overall efficiency of the circuit.

Maximum Switch-on Time: 48 ns

Fast switching times enable high-speed signal processing, essential for modern electronic devices.

Length: 2.05 mm

Compact length supports integration into tight layouts where space is limited.

Maximum Switch-off Time: 21 ns

Quick switch-off times improve system responsiveness in high-speed applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and compliance in safety-critical environments.

Technology: CMOS

CMOS technology provides low power consumption and a high integration level, suitable for complex applications.

Terminal Form: GULL WING

Gull wing design improves accessibility for soldering, enhancing manufacturability and reliability.

Terminal Pitch: 0.65 mm

Standard terminal pitch allows for compatibility with a variety of PCB designs and manufacturing processes.

Maximum Supply Voltage (Vsup): 4.3 V

Supports a wide range of supply voltages, making the device adaptable to different circuit requirements.

Nominal Off-state Isolation: 90 dB

High isolation minimizes crosstalk and interference between channels, enhancing signal integrity.

Technical Specifications

Multiplexers & Switches NX3L1G66GW,125 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Nominal Off-state Isolation:

90 dB

Maximum On-state Resistance (Ron):

1.7 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Maximum Switch-off Time:

21 ns

Maximum Switch-on Time:

48 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

NX3L1G66GW,125 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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