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MVF50NS152CMK40

NXP Semiconductors

MVF50NS152CMK40 by NXP Semiconductors

NXP Semiconductors' MVF50NS152CMK40 microprocessor features 32-bit architecture, 1.1V max supply voltage, and integrated cache. Ideal for applications requiring high-speed processing in a compact form factor with low power consumption. Suitable for use in various electronic devices due to its advanced technology and efficient design.

Median Price

$25.640

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,681 parts In-Stock

1+ parts

-

100+ parts

$25.640

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1,681

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$25.640

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Flip Electronics (Authorized)

USA . 1,681 parts In-Stock

1+ parts

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1,681

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Verical

USA . 1,681 parts In-Stock

1+ parts

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100+ parts

$29.610

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1,681

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$29.610

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Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$24.040

1k+ parts

$21.510

10k+ parts

$20.240

90

-

$24.040

$21.510

$20.240

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,456 parts In-Stock

1+ parts

$23.310

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4,456

$23.310

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Digiode

USA . 76 parts In-Stock

1+ parts

$25.374

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76

$25.374

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Anansix

USA . 2,076 parts In-Stock

1+ parts

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2,076

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Flip Electronics

USA . 1,681 parts In-Stock

1+ parts

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100+ parts

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1,681

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DigiKey Marketplace

USA . 90 parts In-Stock

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90

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,924 parts In-Stock

1+ parts

$24.039

100+ parts

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1,924

$24.039

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Component Stockers USA

USA . 105 parts In-Stock

1+ parts

$27.640

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105

$27.640

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Microchip USA

USA . 1,716 parts In-Stock

1+ parts

$59.570

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1,716

$59.570

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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UNI Independent Distributors

Spain . 807 parts In-Stock

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807

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Overview

Discover a world of possibilities with the MVF50NS152CMK40 by NXP Semiconductors. This cutting-edge microprocessor is designed to deliver superior performance and reliability in a wide range of applications. With integrated cache and advanced technology, this product offers unmatched value and benefits to customers seeking high-quality solutions for their projects. Whether you're working on IoT devices, automotive systems, or industrial automation, the MVF50NS152CMK40 is the perfect choice to take your creations to the next level. Trust NXP Semiconductors for top-notch quality and innovation that sets you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material for the package body makes the microprocessor lightweight and durable, ensuring easy handling and long-lasting performance.

Integrated Cache: YES

The presence of integrated cache enhances the performance of the microprocessor by providing quick access to frequently used data and instructions, resulting in faster processing speeds.

Maximum Supply Voltage: 1.1 V

Operating at a maximum supply voltage of 1.1 V allows for efficient power consumption and lower heat generation, leading to improved energy efficiency.

On Chip Data RAM Width: 8

The wide data RAM width of 8 bits enables the microprocessor to efficiently handle and process large volumes of data, enhancing its overall performance capabilities.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it suitable for integration in various electronic devices where size constraints may be a concern.

Bit Size: 32

With a 32-bit architecture, the microprocessor can process data in larger chunks, improving overall computational efficiency and performance.

No. of Terminals: 364

The high number of terminals allows for increased connectivity options and supports the integration of multiple components, expanding the functionality and versatility of the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor allows for simplified and streamlined instruction execution, resulting in faster processing speeds and improved performance.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microprocessor can withstand moderate exposure to moisture during assembly and operation, ensuring reliability and longevity in various environmental conditions.

Technical Specifications

Microprocessors MVF50NS152CMK40 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B364

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of Serial I/Os:

7

No. of Terminals:

364

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA364,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

1572864

Maximum Seated Height:

1.5 mm

Speed:

400 rpm

Maximum Supply Current:

850 mA

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MVF50NS152CMK40 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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