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MPC5554MVR132R2

NXP Semiconductors

MPC5554MVR132R2 by NXP Semiconductors

NXP Semiconductors' MPC5554MVR132R2 is a 32-bit microcontroller with 24-bit address bus width, operating at up to 20 MHz. Ideal for automotive applications, it features flash ROM programmability, PWM channels, and ADC support. With a temperature range of -40 to 125 °C, this CMOS technology-based microcontroller offers high performance in a compact grid array package.

Median Price

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Lifecycle Status

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Anansix

USA . 1,937 parts In-Stock

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Digiode

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Vyrian

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Chip Stock

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Nova Conductors

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Ampacity Inc.

Singapore . 472 parts In-Stock

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AZTECH Wire

Italy . 866 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,020 parts In-Stock

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Semicontronic

India . 484 parts In-Stock

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One Stop Electronics

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Advanced Electronics

New Zealand . 35 parts In-Stock

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Corohmni

South Africa . 683 parts In-Stock

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Component Stockers USA

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Microchip USA

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Continental Prestige Electronics

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Perfect Parts

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UNI Independent Distributors

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Argo Parts USA

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iodParts Technologies Inc.

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Overview

Unleash the power of innovation with the NXP Semiconductors MPC5554MVR132R2 microcontroller. Crafted with precision and expertise, this cutting-edge device offers unmatched quality and reliability. Ideal for automotive applications, this microcontroller guarantees seamless performance and efficiency. Experience the value and benefits of advanced technology with the MPC5554MVR132R2, where speed meets precision to elevate your projects to new heights. Trust NXP Semiconductors for superior products that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the microcontroller, making it suitable for a variety of environments.

Maximum Supply Voltage: 1.65 V

Higher maximum supply voltage allows for flexibility in power input, making the microcontroller versatile in different power supply setups.

Bit Size: 32

32-bit architecture allows for faster and more efficient processing of data, making the microcontroller suitable for tasks that require high performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the microcontroller to operate reliably in high-temperature environments, making it suitable for industrial and automotive applications.

ROM Programmability: FLASH

ROM programmability with flash memory enables easy and quick updates to the microcontroller's firmware, enhancing its flexibility and adaptability.

Technical Specifications

Microcontrollers MPC5554MVR132R2 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

IT ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B416

Length:

27 mm

No. of Terminals:

416

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

2.55 mm

Speed:

132 rpm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC5554MVR132R2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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