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MPC5125YVN400R

NXP Semiconductors

MPC5125YVN400R by NXP Semiconductors

NXP Semiconductors' MPC5125YVN400R is a 32-bit microcontroller with 324 terminals, operating at a max frequency of 35 MHz. Ideal for automotive applications, it features flash ROM programmability, 128 I/O lines, and supports DMA channels for efficient data transfer.

Median Price

$28.280

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10 parts In-Stock

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$28.280

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$28.280

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Verical

USA . 10 parts In-Stock

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$28.280

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Chip1Stop

Japan . 1,500 parts In-Stock

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$26.460

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$26.460

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Distributors (In-Stock)

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Nova Conductors

Japan . 1,000 parts In-Stock

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$35.563

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$35.563

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Digiode

USA . 3,606 parts In-Stock

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$41.354

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Chip Stock

USA . 4,000 parts In-Stock

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Anansix

USA . 1,508 parts In-Stock

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Vyrian

USA . 651 parts In-Stock

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Sensible Micro Corp

USA . 461 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,204 parts In-Stock

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$22.490

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One Stop Electronics

USA . 1,061 parts In-Stock

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$22.490

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Semicontronic

India . 810 parts In-Stock

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$22.490

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$21.928

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$21.815

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810

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$21.815

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Continental Prestige Electronics

USA . 4,906 parts In-Stock

1+ parts

$33.464

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$32.795

4,906

$33.464

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$32.795

Corphita

USA . 1,625 parts In-Stock

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$39.177

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Vigor

Singapore . 231 parts In-Stock

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$42.342

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Advanced Electronics

New Zealand . 67 parts In-Stock

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$47.756

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$45.368

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$45.368

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$45.368

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Aztec Data Supply Inc.

USA . 87 parts In-Stock

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$54.100

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Corohmni

South Africa . 21 parts In-Stock

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$58.529

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Microchip USA

USA . 3,010 parts In-Stock

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Lixinc

USA . 16,453 parts In-Stock

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Argo Parts USA

USA . 4,490 parts In-Stock

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UNI Independent Distributors

Spain . 3,205 parts In-Stock

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Robosynatics

Brazil . 3,085 parts In-Stock

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$50.753

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$49.717

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$49.717

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$49.717

Lucentia Tech

USA . 3,085 parts In-Stock

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$50.753

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$49.717

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$49.717

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Futuretech Components

Singapore . 2,500 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$34.852

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$33.785

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$33.074

50

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$34.852

$33.785

$33.074

Overview

Unlock the potential of your electronic devices with the MPC5125YVN400R microcontroller by NXP Semiconductors. Built with precision and reliability, this microcontroller offers a seamless integration into various applications, providing unmatched performance and efficiency. Whether you're in the automotive industry or developing cutting-edge technology, this product delivers value and innovation that exceeds expectations. Experience the power of NXP Semiconductors and elevate your projects to new heights with the MPC5125YVN400R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to environmental factors, ensuring the longevity of the microcontroller.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in the manufacturing process.

Maximum Supply Voltage: 1.47 V

With a maximum supply voltage of 1.47 V, this microcontroller is suitable for low power applications, helping in energy efficiency.

Package Shape: SQUARE

The square package shape offers efficient use of board space and better thermal management, making it suitable for compact designs.

Bit Size: 32

32-bit architecture allows for high-performance computing and faster processing speeds, making it ideal for applications requiring complex algorithms.

Power Supplies (V): 1.4,3.3

Support for multiple power supply voltages (1.4V and 3.3V) provides flexibility in design to accommodate different power requirements for various peripherals.

No. of Terminals: 324

High number of terminals allow for connecting numerous external components and peripherals, making it suitable for versatile applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides high density interconnects and improves signal integrity, enhancing the overall performance of the microcontroller.

Minimum Supply Voltage: 1.33 V

Low minimum supply voltage ensures efficient operation even at lower power levels, enabling energy-saving capabilities in the device.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance allows the microcontroller to operate reliably in harsh environmental conditions, suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range from -40°C to 125°C ensures the microcontroller's functionality in extreme temperature conditions, making it versatile and reliable.

Terminal Finish: TIN SILVER

TIN SILVER terminal finish provides good connectivity and corrosion resistance, ensuring long-term reliability in various operating environments.

DMA Channels: YES

Support for Direct Memory Access (DMA) channels enables efficient data transfer between memory and peripherals, enhancing performance and reducing processor load.

Terminal Position: BOTTOM

Bottom terminal position makes the microcontroller suitable for compact PCB designs, improving signal routing and space utilization.

Maximum Seated Height: 2.55 mm

Low maximum seated height allows for slim and compact overall device design, ideal for space-constrained applications.

Width: 23 mm

The compact width of 23 mm enables easy integration into various system designs, providing flexibility for different form factors.

External Data Bus Width: 8

8-bit external data bus width allows for efficient data transfer between the microcontroller and external devices, enhancing overall system performance.

Maximum Clock Frequency: 35 MHz

High maximum clock frequency of 35 MHz enables fast processing speed and efficient execution of instructions, suitable for applications requiring real-time responsiveness.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds at peak temperature, the microcontroller ensures reliable soldering during assembly processes, reducing the risk of solder defects.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper solder melting and joint formation during assembly, leading to robust and reliable solder connections.

Length: 23 mm

Compact length of 23 mm provides flexibility in PCB layout and system integration, making it suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable operation in automotive environments, meeting industry standards for performance and durability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller allows for efficient and fast instruction execution, making it suitable for high-performance applications that require quick response times.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation in various applications.

Terminal Form: BALL

Ball terminal form provides good solder joint reliability and signal integrity, ensuring secure connections for stable performance in the device.

Nominal Supply Voltage: 1.4 V

Stable nominal supply voltage of 1.4 V ensures consistent power delivery to the microcontroller, supporting reliable and robust operations.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and easy firmware updates, enabling customization and future-proofing of the device for evolving requirements.

Terminal Pitch: 1 mm

1 mm terminal pitch offers reliable soldering connections and ease of assembly, ensuring smooth integration into the PCB layout.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 indicates moderate sensitivity to moisture during storage and assembly processes, guiding proper handling and storage of the microcontroller to avoid damage.

Speed: 400 rpm

High-speed operation of 400 rpm allows for quick data processing and system responsiveness, making the microcontroller suitable for time-critical applications.

No. of I/O Lines: 128

Abundance of I/O lines (128) provide versatile connectivity options for external devices and peripherals, enabling diverse functionality and interface capabilities in the system.

Technical Specifications

Microcontrollers MPC5125YVN400R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

35 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e2

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

128

No. of Terminals:

324

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA324,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.55 mm

Speed:

400 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.47 V

Minimum Supply Voltage:

1.33 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

23 mm

Peripheral IC Type:

Trade Compliance

MPC5125YVN400R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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