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MPC555LFMZP40

Onsemi

MPC555LFMZP40 by Onsemi

MPC555LFMZP40 by Onsemi is a 32-bit microcontroller with 24-bit address bus width, operating at up to 20 MHz. Ideal for automotive applications, it features 101 I/O lines, PWM channels, and ADC channels. With a package style of grid array and HCMOS technology, it offers high performance in a compact form factor.

Median Price

$123.410

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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Verical

USA . 2 parts In-Stock

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$123.410

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$123.410

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Arrow

USA . 2 parts In-Stock

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$123.410

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DigiKey

USA . 25,830 parts In-Stock

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Avnet

USA . 56 parts In-Stock

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$132.473

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$131.107

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$131.107

Distributors (In-Stock)

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Digiode

USA . 4,556 parts In-Stock

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$112.496

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4,556

$112.496

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DF Sales Co.

USA . 3 parts In-Stock

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$150.000

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DF Sales Co.

USA . 3 parts In-Stock

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$150.000

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Nova Conductors

Japan . 1,000 parts In-Stock

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$153.490

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$153.490

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Flip Electronics

USA . 27,327 parts In-Stock

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Vyrian

USA . 4,057 parts In-Stock

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Anansix

USA . 1,950 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 28 parts In-Stock

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R&J Components

USA . 10 parts In-Stock

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4 Star Electronics, Inc.

USA . 6 parts In-Stock

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PC Components Company LLC

USA . 3 parts In-Stock

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Bristol Electronics

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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ComSIT USA

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J2 Sourcing AB

Sweden . 1 parts In-Stock

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Electronics Depot

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Distributors (Availability)

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AZTECH Wire

Italy . 671 parts In-Stock

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$7.002

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671

$7.002

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Aztec Data Supply Inc.

USA . 221 parts In-Stock

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$84.950

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$84.950

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One Stop Electronics

USA . 83 parts In-Stock

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$100.650

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$100.650

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$100.650

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Corphita

USA . 6,364 parts In-Stock

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$106.575

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$106.575

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Corohmni

South Africa . 243 parts In-Stock

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$153.486

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Continental Prestige Electronics

USA . 5,745 parts In-Stock

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$153.490

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$150.420

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$153.490

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Vigor

Singapore . 338 parts In-Stock

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$182.730

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Microchip USA

USA . 2,671 parts In-Stock

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$247.860

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Component Stockers USA

USA . 33 parts In-Stock

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$2,089.280

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Lixinc

USA . 19,461 parts In-Stock

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UNI Independent Distributors

Spain . 7,816 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Kulean Microsystems

USA . 5,941 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,243 parts In-Stock

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TANS Electronics

Latvia . 1,523 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 362 parts In-Stock

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SupplyDigital Components

Austria . 307 parts In-Stock

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UHIMA Technologies

Türkiye . 115 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$150.420

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$145.816

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$142.746

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$145.816

$142.746

Overview

Unlock unparalleled performance and reliability with the MPC555LFMZP40 microcontroller by Onsemi. Designed with cutting-edge technology, this microcontroller offers a wide range of applications in various industries. From automotive to industrial automation, this powerful device provides exceptional value with its high-quality construction and innovative features. Experience seamless operation and enhanced efficiency with the MPC555LFMZP40, making it the perfect choice for your next project. Choose Onsemi for superior performance and unmatched advantages in microcontroller technology.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is lightweight and durable, making the microcontroller suitable for various applications.

Surface Mount:

YES - This feature allows for easy and compact PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage:

3.6 V - The high maximum supply voltage provides flexibility and compatibility with different power sources.

Address Bus Width:

24 - A wider address bus allows for efficient data processing and handling of larger memory capacities.

Package Shape:

SQUARE - The square shape offers a balanced and space-saving design for effective PCB layout and integration.

Bit Size:

32 - With a 32-bit architecture, the microcontroller can perform complex operations and calculations with precision.

No. of Terminals:

272 - The abundance of terminals enables connectivity with multiple external devices and peripherals.

Package Style (Meter):

GRID ARRAY - The grid array package style ensures secure and reliable connections for stable performance.

Minimum Supply Voltage:

3 V - The low minimum supply voltage allows for energy-efficient operation and extends battery life.

Maximum Operating Temperature:

125 °C - The high operating temperature range makes the microcontroller suitable for harsh environments and automotive applications.

Minimum Operating Temperature:

40 °C - The wide temperature range ensures reliable operation in extreme cold conditions.

ADC Channels:

YES - The Analog-to-Digital Converter channels enable the microcontroller to process analog input signals for a wider range of applications.

Terminal Position:

BOTTOM - The bottom terminal position simplifies PCB layout and facilitates heat dissipation for better performance.

Maximum Seated Height:

2.65 mm - The low seated height allows for compact and slim designs in space-constrained applications.

Width:

27 mm - The moderate width of the microcontroller provides a good balance between size and functionality.

External Data Bus Width:

32 - A wide external data bus width ensures fast and efficient data communication within the system.

Maximum Clock Frequency:

20 MHz - The high clock frequency enables rapid data processing and execution of tasks with minimal delay.

Length:

27 mm - The length provides a compact form factor suitable for various embedded applications requiring space efficiency.

Temperature Grade:

AUTOMOTIVE - The automotive temperature grade certification ensures reliability and performance in automotive applications.

Peripheral IC Type:

MICROCONTROLLER, RISC - The RISC architecture enhances processing speed and efficiency for improved system performance.

Technology:

HCMOS - The HCMOS technology offers low power consumption and high noise immunity for stable and efficient operation.

Terminal Form:

BALL - The ball terminal form provides reliable connections and simplifies the soldering process during assembly.

Nominal Supply Voltage:

3.3 V - The nominal supply voltage offers stable and consistent power delivery for reliable operation.

PWM Channels:

YES - The Pulse Width Modulation channels allow for precise control of analog components for versatile applications.

ROM Programmability:

FLASH - The Flash ROM programmability enables convenient and quick updates to the microcontroller firmware.

Terminal Pitch:

1.27 mm - The fine terminal pitch allows for high-density PCB designs with intricate circuitry and components.

Speed:

40 rpm - The moderate speed capability meets the requirements of various applications without compromising performance.

No. of I/O Lines:

101 - The abundance of Input/Output lines provides flexibility in interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MPC555LFMZP40 attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B272

Length:

27 mm

No. of I/O Lines:

101

No. of Terminals:

272

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC555LFMZP40 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-519-1342, 5962015191342, 5962-01-526-6606, 5962015266606

NIIN

015191342, 015266606

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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