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MPC5554MVR132

NXP Semiconductors

MPC5554MVR132 by NXP Semiconductors

NXP Semiconductors' MPC5554MVR132 microcontroller features 32-bit architecture, 24-bit address bus, and 220 I/O lines. With a max clock frequency of 20 MHz, it is ideal for automotive applications requiring high-speed processing and extensive I/O capabilities. The microcontroller operates in a temperature range from -40°C to 125°C, making it suitable for harsh environments.

Median Price

$108.620

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 165 parts In-Stock

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$86.430

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$68.630

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Arrow

USA . 1,862 parts In-Stock

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$108.620

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$77.830

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Verical

USA . 1,862 parts In-Stock

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$108.620

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$77.830

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Mouser Electronics

USA . 302 parts In-Stock

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$109.480

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$89.120

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302

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DigiKey

USA . 216 parts In-Stock

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$109.480

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$87.364

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216

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$87.364

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EBV Elektronik

Germany . 2,680 parts In-Stock

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2,680

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Newark

USA . 1,463 parts In-Stock

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$66.250

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Avnet

USA . 160 parts In-Stock

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Digiode

USA . 4,552 parts In-Stock

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$68.191

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Nova Conductors

Japan . 500 parts In-Stock

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$70.980

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Flip Electronics

USA . 5,000 parts In-Stock

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Anansix

USA . 398 parts In-Stock

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Chip Stock

USA . 325 parts In-Stock

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325

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TME

Poland . 170 parts In-Stock

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$94.730

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Vyrian

USA . 117 parts In-Stock

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ComSIT Distribution GmbH

Germany . 17 parts In-Stock

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LWI Electronics Inc

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Distributors (Availability)

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AZTECH Wire

Italy . 743 parts In-Stock

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$12.016

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743

$12.016

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$41.791

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$38.030

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$34.269

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$41.791

$38.030

$34.269

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Aztec Data Supply Inc.

USA . 341 parts In-Stock

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$44.317

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341

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Semicontronic

India . 138 parts In-Stock

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$54.710

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$53.342

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$53.069

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$54.710

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$53.069

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Ampacity Inc.

Singapore . 23 parts In-Stock

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$61.010

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Corphita

USA . 4,533 parts In-Stock

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Continental Prestige Electronics

USA . 2,832 parts In-Stock

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$70.980

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$69.560

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Corohmni

South Africa . 40 parts In-Stock

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$74.380

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Vigor

Singapore . 3,000 parts In-Stock

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Microchip USA

USA . 2,446 parts In-Stock

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Lixinc

USA . 15,970 parts In-Stock

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UNI Independent Distributors

Spain . 5,374 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

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S.R.D Solutions

India . 3,000 parts In-Stock

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Perfect Parts

USA . 2,752 parts In-Stock

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Argo Parts USA

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Netroflash

USA . 500 parts In-Stock

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$69.560

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$67.431

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$66.011

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$67.431

$66.011

Infinite Electronics LLP (Excess)

. 401 parts In-Stock

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iodParts Technologies Inc.

India . 150 parts In-Stock

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A-Z Elektronik GmbH

Germany . 144 parts In-Stock

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Overview

Unleash the power of innovation with the NXP Semiconductors MPC5554MVR132 microcontroller. This cutting-edge device offers unparalleled performance and reliability, suitable for a wide range of applications in the automotive industry and beyond. With advanced features and top-notch quality, this microcontroller ensures seamless operation and maximizes efficiency for your projects. Elevate your designs and stay ahead of the competition with the MPC5554MVR132 from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount:

YES - The surface mount feature allows for easy installation and space-saving design, making it convenient for compact electronic devices.

Maximum Supply Voltage:

1.65 V - The wide range of supply voltage allows flexibility in power requirements for different projects.

Address Bus Width:

24 - The wide address bus width enables efficient memory management and data processing for enhanced performance.

Package Shape:

SQUARE - The square package shape offers a compact form factor, suitable for applications where space is limited.

Bit Size:

32 - The 32-bit architecture enhances processing speed and efficiency, making it suitable for demanding tasks.

Power Supplies (V):

1.5,3.3,5 - The multiple power supply options provide versatility and compatibility with various power sources.

No. of Terminals:

416 - The high number of terminals allows for extensive connectivity options and interfacing capabilities.

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG - The package style ensures efficient heat dissipation and reliability in operation.

Minimum Supply Voltage:

1.35 V - The low minimum supply voltage requirement helps in reducing power consumption and extending battery life.

Maximum Operating Temperature:

125 °C - The high operating temperature range ensures the microcontroller can withstand harsh environmental conditions.

Minimum Operating Temperature:

40 °C - The wide temperature range allows the microcontroller to function reliably in extreme cold environments.

Terminal Finish:

TIN SILVER COPPER - The terminal finish provides excellent conductivity and corrosion resistance for long-term durability.

ADC Channels:

YES - The Analog-to-Digital Converter channels allow for accurate and precise analog signal measurements, expanding the microcontroller's capabilities.

Terminal Position:

BOTTOM - The bottom terminal position facilitates easy PCB mounting and integration into electronic systems.

ROM Words:

2097152 - The large ROM capacity enables storing a significant amount of program data for complex applications.

Maximum Seated Height:

2.55 mm - The low seated height profile allows for compact and slim device designs.

Width:

27 mm - The moderate width size provides a balance between space-saving and easy handling during integration.

External Data Bus Width:

32 - The wide external data bus width ensures fast data transfer and processing speed.

Maximum Clock Frequency:

20 MHz - The high clock frequency capability allows for rapid execution of instructions, suitable for real-time applications.

Technical Specifications

Microcontrollers MPC5554MVR132 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

IT ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B416

JESD-609 Code:

e1

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

220

No. of Terminals:

416

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA416,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3,5

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

2.55 mm

Speed:

132 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

600 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC5554MVR132 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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