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MMDS09254HT1

NXP Semiconductors

MMDS09254HT1 by NXP Semiconductors

TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; JESD-609 Code: e3;

Median Price

$12.626

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 528 parts In-Stock

1+ parts

$9.002

100+ parts

-

1k+ parts

-

10k+ parts

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528

$9.002

-

-

-

Rochester

USA . 963 parts In-Stock

1+ parts

-

100+ parts

$16.250

1k+ parts

$14.540

10k+ parts

$13.680

963

-

$16.250

$14.540

$13.680

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,749 parts In-Stock

1+ parts

$8.552

100+ parts

-

1k+ parts

-

10k+ parts

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2,749

$8.552

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-

Vyrian

USA . 9,960 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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9,960

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-

-

-

Anansix

USA . 1,563 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,563

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-

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Flip Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,624 parts In-Stock

1+ parts

$8.102

100+ parts

-

1k+ parts

-

10k+ parts

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1,624

$8.102

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-

AZTECH Wire

Italy . 1,182 parts In-Stock

1+ parts

$10.540

100+ parts

-

1k+ parts

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1,182

$10.540

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UNI Independent Distributors

Spain . 329 parts In-Stock

1+ parts

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329

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Technical Specifications

Other Function Telecom Interface ICs MMDS09254HT1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.23,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Trade Compliance

MMDS09254HT1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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