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MMA7660FCR1

NXP Semiconductors

MMA7660FCR1 by NXP Semiconductors

NXP Semiconductors' MMA7660FCR1 is a small outline, very thin profile analog circuit with 10 terminals and gold finish. Operating b/w -40 to 85°C, it has a supply voltage range of 2.4V to 3.6V and peak reflow temperature of 245°C. Ideal for industrial applications requiring precise motion sensing in compact spaces.

Median Price

$0.905

Lifecycle Status

Suppliers In-Stock

22

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1k+

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Rochester

USA . 796 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Goldney Electronics S.L.

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Digiode

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Bristol Electronics

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Semtec, LLC

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Vyrian

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Speed Components Ltd

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A&K Electronics

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ECAB

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Argo Parts USA

USA . 3,680 parts In-Stock

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$0.565

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$0.548

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Continental Prestige Electronics

USA . 3,621 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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One Stop Electronics

USA . 1,247 parts In-Stock

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Ampacity Inc.

Singapore . 1,159 parts In-Stock

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Semicontronic

India . 168 parts In-Stock

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AZTECH Wire

Italy . 194 parts In-Stock

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Andel Nordic

Denmark . 5,073 parts In-Stock

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Aztec Data Supply Inc.

USA . 64 parts In-Stock

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Robosynatics

Brazil . 1,112 parts In-Stock

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Lucentia Tech

USA . 1,112 parts In-Stock

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Assy Fe

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Overview

Elevate your projects with the MMA7660FCR1 from NXP Semiconductors, a leading manufacturer known for top-quality semiconductor products. This versatile sensor offers precise measurements and reliable performance, making it ideal for a wide range of applications. Whether you're designing wearable tech, smart home devices, or IoT solutions, this compact and durable sensor provides unmatched value, accuracy, and efficiency. Stay ahead of the curve with the MMA7660FCR1 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY body material offers good insulation and protection for the semiconductor, ensuring durability and reliability.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 2.8 V

Operates efficiently at 2.8V supply voltage, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures up to 85°C, ensuring performance in demanding industrial environments.

Terminal Finish: GOLD

Gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall reliability of the semiconductor.

Width (mm): 3 mm

Compact 3mm width allows for space-saving installation and integration in tight spaces or densely populated circuit boards.

Technical Specifications

Other Function Semiconductors MMA7660FCR1 attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

MMA7660FCR1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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