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MMA7455LR1

NXP Semiconductors

MMA7455LR1 by NXP Semiconductors

NXP Semiconductors' MMA7455LR1 is a surface mount IC with 14 terminals, operating from -40 to 85°C. It has a supply voltage range of 2.4V to 3.6V and measures 5mm x 3mm in size. This analog circuit is ideal for industrial applications requiring precise motion sensing capabilities.

Median Price

$1.283

Lifecycle Status

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Nova Conductors

Japan . 17 parts In-Stock

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Digiode

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Anansix

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Speed Components Ltd

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Vyrian

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,780 parts In-Stock

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Argo Parts USA

USA . 1,292 parts In-Stock

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Ampacity Inc.

Singapore . 190 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 416 parts In-Stock

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$10.660

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Corohmni

South Africa . 421 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,572 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Component Stockers USA

USA . 571 parts In-Stock

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Glotronic Ltd.

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ChipstoGo Electronic ltd

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Overview

Discover the cutting-edge MMA7455LR1 by NXP Semiconductors, a top-of-the-line product in the category of Other Function Semiconductors. With its surface mount technology and industrial-grade temperature grade, this rectangular package is perfect for a wide range of applications. NXP Semiconductors, known for their exceptional quality and reliability, delivers a product that exceeds expectations. Experience the value and advantages of the MMA7455LR1, offering precision and performance like never before. Elevate your projects with this innovative solution today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easier and more efficient installation of the component onto circuit boards.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design and efficient use of space on the circuit board.

Nominal Supply Voltage (Vsup): 2.8 V

The 2.8V supply voltage offers a balanced power consumption for the component, making it suitable for various applications.

No. of Terminals: 14

With 14 terminals, this component can support complex circuit configurations and more connections, allowing for versatile usage.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style contributes to better electrical performance and thermal management.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability of the component in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold environments without compromising performance.

Terminal Position: BOTTOM

The bottom terminal position offers easy accessibility for connections and reduces the overall footprint on the circuit board.

Maximum Seated Height: 1.05 mm

The low seated height contributes to a compact design and helps save space in the overall system layout.

Width (mm): 3 mm

The 3mm width provides compatibility with standard circuit board layouts and ensures easy integration into existing systems.

Other IC type: ANALOG CIRCUIT

Being an analog circuit type, this component is suitable for applications requiring precision signal processing and amplification.

Minimum Supply Voltage (Vsup): 2.4 V

The 2.4V minimum supply voltage ensures flexibility in power input options and compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature allows for efficient soldering and assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability of connections during the manufacturing process.

Length: 5 mm

The 5mm length provides a compact form factor and enables dense packing of components on the circuit board.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the component can withstand harsh environmental conditions and extended operating durations.

Terminal Form: BUTT

The butt terminal form ensures secure and stable connections with other components or circuit elements.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for precise and compact placement of connections on the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the component has a moderate sensitivity to moisture, making it suitable for standard manufacturing and assembly processes.

Maximum Supply Voltage (Vsup): 3.6 V

The 3.6V maximum supply voltage provides a wider operating voltage range, allowing for versatility in power supply options.

Technical Specifications

Other Function Semiconductors MMA7455LR1 attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-XBGA-B14

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.05 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3 mm

Trade Compliance

MMA7455LR1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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