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MMA7361LR1

NXP Semiconductors

MMA7361LR1 by NXP Semiconductors

MMA7361LR1 by NXP Semiconductors is a 14-terminal chip carrier with a supply voltage range of 2.2V to 3.6V, operating from -40°C to 85°C. This analog circuit in plastic/epoxy package is surface-mountable and ideal for industrial applications requiring precise motion sensing capabilities at a nominal voltage of 3.3V.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Digiode

USA . 4,677 parts In-Stock

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Anansix

USA . 881 parts In-Stock

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881

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Vyrian

USA . 434 parts In-Stock

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Bristol Electronics

USA . 8 parts In-Stock

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Ampacity Inc.

Singapore . 1,292 parts In-Stock

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$2.500

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$2.500

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One Stop Electronics

USA . 3,228 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 434 parts In-Stock

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$17.470

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$16.780

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$16.440

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$16.110

434

$17.470

$16.780

$16.440

$16.110

UNI Independent Distributors

Spain . 6,649 parts In-Stock

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Argo Parts USA

USA . 3,666 parts In-Stock

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Kepictronics

USA . 3,245 parts In-Stock

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Corphita

USA . 1,974 parts In-Stock

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Continental Prestige Electronics

USA . 1,955 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Experience unrivaled performance with the MMA7361LR1 from NXP Semiconductors. As a leader in semiconductor technology, NXP delivers top-quality products that meet the highest industry standards. The MMA7361LR1 is a versatile solution for a wide range of applications, providing customers with exceptional value and benefits. Whether you're looking to enhance your industrial processes or create innovative consumer electronics, this product offers the reliability and precision you need to succeed. Upgrade your projects with the MMA7361LR1 and discover the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the semiconductor, ensuring long-lasting performance in various applications.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving time and effort during installation.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a standard supply voltage, making it compatible with a wide range of systems and devices.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for applications in industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature conditions, making it versatile for use in various climates and settings.

Width (mm): 3 mm

Compact size allows for space-saving installation in tight or crowded electronic assemblies.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards for temperature range and performance, ensuring reliable operation in demanding environments.

Technical Specifications

Other Function Semiconductors MMA7361LR1 attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PBCC-B14

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LGA14,3X6,32

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.05 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3 mm

Trade Compliance

MMA7361LR1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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