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MMA7361LR2

NXP Semiconductors

MMA7361LR2 by NXP Semiconductors

MMA7361LR2 by NXP Semiconductors is a 14-terminal chip carrier with a supply voltage range of 2.2V to 3.6V, operating b/w -40°C to 85°C. This analog circuit has a compact size of 5mm x 3mm and is suitable for industrial applications requiring precise motion sensing capabilities at peak reflow temperatures up to 260°C.

Median Price

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Lifecycle Status

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4

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1k+

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Digiode

USA . 2,728 parts In-Stock

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Anansix

USA . 1,348 parts In-Stock

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Vyrian

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Nova Conductors

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One Stop Electronics

USA . 831 parts In-Stock

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$3.500

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Ampacity Inc.

Singapore . 1,556 parts In-Stock

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AZTECH Wire

Italy . 299 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,744 parts In-Stock

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Corohmni

South Africa . 79 parts In-Stock

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Component Stockers USA

USA . 224 parts In-Stock

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$99.990

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Continental Prestige Electronics

USA . 4,913 parts In-Stock

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Argo Parts USA

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Corphita

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UNI Independent Distributors

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Overview

Unleash the power of motion sensing technology with the MMA7361LR2 by NXP Semiconductors. This cutting-edge semiconductor offers unparalleled quality and reliability, making it ideal for a wide range of applications. Whether you're designing a wearable fitness tracker or a smart home device, this chip carrier package will exceed your expectations. With a nominal supply voltage of 3.3V and industrial-grade temperature tolerance, the MMA7361LR2 delivers unmatched performance in any environment. Elevate your projects with the precision and versatility of NXP Semiconductors' innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for the components inside, ensuring reliability and longevity.

Surface Mount: YES

Surface mount packaging allows for easy and compact integration onto circuit boards, saving space and making assembly more efficient.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3V makes this product compatible with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product is suitable for industrial applications where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this product suitable for use in harsh environmental conditions.

Maximum Seated Height: 1.05 mm

With a low seated height of 1.05mm, this product can be used in compact designs where space is limited.

Width (mm): 3 mm

The narrow width of 3mm allows for efficient placement of this product on a circuit board, enabling compact and sleek designs.

Minimum Supply Voltage (Vsup): 2.2 V

A minimum supply voltage of 2.2V ensures that the product can still function under low power conditions, making it versatile in different applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures that the product can withstand the reflow soldering process during assembly without compromising its performance.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades means this product is designed to withstand harsh industrial environments, ensuring reliability and longevity.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand moderate exposure to moisture during storage and assembly processes.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V allows this product to handle higher voltage inputs, making it suitable for a variety of applications.

Technical Specifications

Other Function Semiconductors MMA7361LR2 attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PBCC-B14

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LGA14,3X6,32

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.05 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3 mm

Trade Compliance

MMA7361LR2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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