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MCZ33897TEF

NXP Semiconductors

MCZ33897TEF by NXP Semiconductors

CAN TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$5.370

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

MCZ33897TEF by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 102 parts In-Stock

1+ parts

$5.370

100+ parts

$2.900

1k+ parts

$2.290

10k+ parts

$2.250

102

$5.370

$2.900

$2.290

$2.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,718 parts In-Stock

1+ parts

$3.544

100+ parts

-

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4,718

$3.544

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Flip Electronics

USA . 6,920 parts In-Stock

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6,920

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Vyrian

USA . 6,124 parts In-Stock

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6,124

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Anansix

USA . 1,265 parts In-Stock

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1,265

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 5,807 parts In-Stock

1+ parts

$2.750

100+ parts

$2.610

1k+ parts

$2.520

10k+ parts

-

5,807

$2.750

$2.610

$2.520

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One Stop Electronics

USA . 110 parts In-Stock

1+ parts

$3.170

100+ parts

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110

$3.170

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Corphita

USA . 3,938 parts In-Stock

1+ parts

$3.357

100+ parts

-

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3,938

$3.357

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QUARKTWIN TECHNOLOGY LTD

USA . 17,605 parts In-Stock

1+ parts

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1k+ parts

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17,605

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UNI Independent Distributors

Spain . 7,411 parts In-Stock

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7,411

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Microchip USA

USA . 4,214 parts In-Stock

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4,214

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Perfect Parts

USA . 3,018 parts In-Stock

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3,018

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A-Z Elektronik GmbH

Germany . 1,692 parts In-Stock

1+ parts

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1,692

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Metaverse IC Inc.

Canada . 1,184 parts In-Stock

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1,184

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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Technical Specifications

Network Interfaces MCZ33897TEF attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

.08333 Mbps

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6/26

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

MCZ33897TEF Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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