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MCZ33897TEFR2

NXP Semiconductors

MCZ33897TEFR2 by NXP Semiconductors

MCZ33897TEFR2 by NXP Semiconductors is a CAN transceiver IC with 14 terminals, operating at 6-26V. It features CMOS technology, -40 to 125°C temperature range, and 0.08333 Mbps data rate. Ideal for automotive applications due to its small outline package and matte tin terminal finish.

Median Price

$1.950

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

MCZ33897TEFR2 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 968 parts In-Stock

1+ parts

$1.422

100+ parts

$1.394

1k+ parts

-

10k+ parts

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968

$1.422

$1.394

-

-

Chip1Stop

Japan . 2,568 parts In-Stock

1+ parts

$2.470

100+ parts

-

1k+ parts

-

10k+ parts

-

2,568

$2.470

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Element14

Singapore . 521 parts In-Stock

1+ parts

$3.679

100+ parts

$2.772

1k+ parts

$2.035

10k+ parts

-

521

$3.679

$2.772

$2.035

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DigiKey

USA . 2,953 parts In-Stock

1+ parts

$3.720

100+ parts

$2.316

1k+ parts

$2.133

10k+ parts

$1.962

2,953

$3.720

$2.316

$2.133

$1.962

Rochester

USA . 5,019 parts In-Stock

1+ parts

-

100+ parts

$1.740

1k+ parts

$1.560

10k+ parts

$1.460

5,019

-

$1.740

$1.560

$1.460

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.950

10k+ parts

$1.825

5,000

-

-

$1.950

$1.825

Farnell

UK . 481 parts In-Stock

1+ parts

-

100+ parts

$1.810

1k+ parts

$1.620

10k+ parts

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481

-

$1.810

$1.620

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,825 parts In-Stock

1+ parts

$1.367

100+ parts

-

1k+ parts

-

10k+ parts

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4,825

$1.367

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-

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Digiode

USA . 4,404 parts In-Stock

1+ parts

$1.831

100+ parts

-

1k+ parts

-

10k+ parts

-

4,404

$1.831

-

-

-

Bristol Electronics

USA . 723 parts In-Stock

1+ parts

$3.137

100+ parts

$1.474

1k+ parts

$1.349

10k+ parts

-

723

$3.137

$1.474

$1.349

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Chip Stock

USA . 7,000 parts In-Stock

1+ parts

-

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7,000

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DigiKey Marketplace

USA . 2,200 parts In-Stock

1+ parts

-

100+ parts

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2,200

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-

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Dan-Mar Components

USA . 723 parts In-Stock

1+ parts

-

100+ parts

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723

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ACDS - Activité Composants Distribution Service

France . 439 parts In-Stock

1+ parts

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439

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Anansix

USA . 412 parts In-Stock

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412

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,798 parts In-Stock

1+ parts

$1.734

100+ parts

-

1k+ parts

-

10k+ parts

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2,798

$1.734

-

-

-

Continental Prestige Electronics

USA . 580 parts In-Stock

1+ parts

$3.180

100+ parts

$2.180

1k+ parts

$1.660

10k+ parts

-

580

$3.180

$2.180

$1.660

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Microchip USA

USA . 4,402 parts In-Stock

1+ parts

$12.410

100+ parts

$12.340

1k+ parts

$12.300

10k+ parts

$12.260

4,402

$12.410

$12.340

$12.300

$12.260

QUARKTWIN TECHNOLOGY LTD

USA . 21,035 parts In-Stock

1+ parts

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21,035

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Lixinc

USA . 17,713 parts In-Stock

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17,713

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Infinite Electronics LLP (Excess)

. 14,347 parts In-Stock

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14,347

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Perfect Parts

USA . 11,211 parts In-Stock

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11,211

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A-Z Elektronik GmbH

Germany . 5,954 parts In-Stock

1+ parts

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5,954

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UNI Independent Distributors

Spain . 5,870 parts In-Stock

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5,870

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

1+ parts

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5,000

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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Overview

Unlock seamless communication and connectivity with the MCZ33897TEFR2 by NXP Semiconductors, a trusted leader in the industry. Designed for automotive applications, this CAN transceiver offers unparalleled reliability and performance. With a compact design and wide temperature range, it delivers optimal functionality in harsh environments. Experience the value of enhanced network interfaces and streamline your operations with this innovative solution. Trust NXP Semiconductors to provide top-notch quality and cutting-edge technology for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability, making the product suitable for long-term use in various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 6/26

Wide range of power supply options (6-26V) provide flexibility in usage scenarios, catering to different power requirements.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stability and performance even in harsh conditions, making it suitable for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Nominal Supply Voltage: 12 V

Stable nominal supply voltage of 12V ensures consistent performance and compatibility with a wide range of devices and systems.

Technical Specifications

Network Interfaces MCZ33897TEFR2 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

.08333 Mbps

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6/26

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

MCZ33897TEFR2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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