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MCZ33897BEFR2

Freescale Semiconductor

MCZ33897BEFR2 by Freescale Semiconductor

INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

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In-Stock Inventory

< 1k

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One Stop Electronics

USA . 1,225 parts In-Stock

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$551.000

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1,225

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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A-Z Elektronik GmbH

Germany . 13,767 parts In-Stock

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13,767

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Kepictronics

USA . 5,487 parts In-Stock

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Microchip USA

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Technical Specifications

Network Interfaces MCZ33897BEFR2 attributes and parameters. Explore more Network Interfaces devices from Freescale Semiconductor

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

MCZ33897BEFR2 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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