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MCHC912B32CFUE8

NXP Semiconductors

MCHC912B32CFUE8 by NXP Semiconductors

The NXP Semiconductors MCHC912B32CFUE8 microcontroller features 16-bit address and data bus width, with a max clock frequency of 16 MHz. Ideal for industrial applications, it offers 63 I/O lines, PWM channels, and ADC channels for versatile functionality in a compact flatpack package.

Median Price

$31.080

Lifecycle Status

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In-Stock Inventory

1k+

MCHC912B32CFUE8 by NXP Semiconductors
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Chip1Stop

Japan . 1,099 parts In-Stock

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$30.100

100+ parts

$27.670

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-

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1,099

$30.100

$27.670

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Future Electronics

Canada . 590 parts In-Stock

1+ parts

$31.080

100+ parts

$29.600

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590

$31.080

$29.600

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Arrow

USA . 406 parts In-Stock

1+ parts

$43.460

100+ parts

$31.750

1k+ parts

$30.210

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406

$43.460

$31.750

$30.210

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Verical

USA . 3 parts In-Stock

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Digiode

USA . 4,502 parts In-Stock

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$28.595

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4,502

$28.595

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IBS Electronics

USA . 1,040 parts In-Stock

1+ parts

$42.602

100+ parts

$40.572

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1,040

$42.602

$40.572

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Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$44.360

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38

$44.360

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NAC Semi

USA . 840 parts In-Stock

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$46.820

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$46.820

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Vyrian

USA . 419 parts In-Stock

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Anansix

USA . 132 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 7 parts In-Stock

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Ampacity Inc.

Singapore . 1,081 parts In-Stock

1+ parts

$25.530

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1,081

$25.530

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Semicontronic

India . 771 parts In-Stock

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$25.530

100+ parts

$24.892

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$24.764

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771

$25.530

$24.892

$24.764

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Corphita

USA . 126 parts In-Stock

1+ parts

$27.090

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126

$27.090

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Continental Prestige Electronics

USA . 3,397 parts In-Stock

1+ parts

$36.980

100+ parts

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$36.240

3,397

$36.980

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$36.240

Vigor

Singapore . 1,033 parts In-Stock

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$43.830

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$43.830

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Netroflash

USA . 100 parts In-Stock

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$44.360

100+ parts

$43.473

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100

$44.360

$43.473

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Aztec Data Supply Inc.

USA . 241 parts In-Stock

1+ parts

$72.334

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241

$72.334

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Corohmni

South Africa . 463 parts In-Stock

1+ parts

$83.630

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463

$83.630

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Microchip USA

USA . 1,459 parts In-Stock

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$110.262

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$110.262

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QUARKTWIN TECHNOLOGY LTD

USA . 13,249 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,039 parts In-Stock

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UNI Independent Distributors

Spain . 4,957 parts In-Stock

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Argo Parts USA

USA . 2,978 parts In-Stock

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Perfect Parts

USA . 2,278 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Robosynatics

Brazil . 278 parts In-Stock

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$78.836

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$77.227

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$77.227

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$78.836

$77.227

$77.227

Lucentia Tech

USA . 278 parts In-Stock

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$78.836

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$77.227

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$77.227

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$77.227

GreenTree Electronics

Israel . 170 parts In-Stock

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Authorized Procurement Solutions

USA . 150 parts In-Stock

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Overview

Unlock limitless possibilities with the MCHC912B32CFUE8 microcontroller from NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-notch quality and reliability. This powerful microcontroller is designed to cater to a wide range of applications, offering unparalleled value and benefits to customers. With advanced features and high performance, the MCHC912B32CFUE8 is the perfect choice for your next project, ensuring seamless operation and optimal results every time. Experience innovation at its finest with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and good thermal performance, making the product suitable for various operating conditions.

Surface Mount: YES

Surface mount technology allows for compact design and easy PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources.

Address Bus Width: 16

A wide address bus width of 16 allows for efficient data processing and storage capabilities.

Package Shape: SQUARE

Square package shape provides uniformity and ease of handling during assembly and integration into electronic systems.

Bit Size: 16

16-bit processing capability enables high performance and precision in executing complex instructions and computations.

No. of Terminals: 80

High number of terminals (80) offer versatile connectivity options and peripheral interfaces for enhanced functionality.

Package Style (Meter): FLATPACK

Flatpack package style provides a low-profile and compact form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Support for a minimum supply voltage of 4.5 V ensures stable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of up to 85°C allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Operation down to -40°C ensures functionality in harsh cold environments.

Terminal Finish: TIN

TIN terminal finish provides good electrical conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, making the product suitable for sensor interfacing and data acquisition applications.

Terminal Position: QUAD

Quad terminal positioning facilitates easy PCB layout and routing of signal paths for efficient circuit design.

Maximum Seated Height: 2.45 mm

Low seated height of 2.45 mm enables compact PCB designs and reduces overall system height.

Width: 14 mm

Compact width of 14 mm allows for space-efficient placement on PCBs and integration into small form factor devices.

External Data Bus Width: 16

16-bit external data bus width supports fast and efficient data transfer between the microcontroller and external memory or peripherals.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16 MHz enables fast execution of instructions and real-time processing tasks.

Maximum Time At Peak Reflow Temperature (s): 40

This product can withstand peak reflow temperatures for up to 40 seconds, ensuring proper soldering and assembly in manufacturing processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for reliable soldering and rework operations during PCB assembly.

Length: 14 mm

Compact length of 14 mm contributes to the overall small footprint of the product, suitable for miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product offers integrated peripherals and processing capabilities, simplifying system design and reducing component count.

Technology: HCMOS

High-speed CMOS technology provides efficient power consumption and fast operation, making the product suitable for high-performance applications.

Terminal Form: GULL WING

Gull wing terminal form offers reliable solder joints and easy inspection during assembly, ensuring robust electrical connections.

Nominal Supply Voltage: 5 V

Stable 5 V nominal supply voltage ensures consistent and reliable operation in a wide range of applications.

PWM Channels: YES

Integrated PWM channels allow for precise control of analog signals, essential for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability enables firmware updates and flexible memory configurations, enhancing the versatility of the microcontroller.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm facilitates high-density PCB layouts and miniaturization of electronic devices.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture during storage and handling, requiring standard precautions in assembly.

Speed: 8 rpm

Operating speed of 8 rpm ensures efficient data processing and system performance for various applications.

No. of I/O Lines: 63

With 63 I/O lines, this microcontroller offers ample connectivity for interfacing with external devices and peripherals, enhancing system flexibility.

Technical Specifications

Microcontrollers MCHC912B32CFUE8 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

63

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.45 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCHC912B32CFUE8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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