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MCHC11F1CFNE4R

NXP Semiconductors

MCHC11F1CFNE4R by NXP Semiconductors

MCHC11F1CFNE4R by NXP Semiconductors is an 8-bit microcontroller with a clock frequency of 16 MHz, suitable for industrial applications. It features a 16-bit address bus width and operates within a temperature range of -40 to 85°C. With 54 I/O lines and EEPROM ROM programmability, it offers versatile functionality in a compact chip carrier package.

Median Price

$27.948

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1k+

MCHC11F1CFNE4R by NXP Semiconductors
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Flip Electronics (Authorized)

USA . 6,430 parts In-Stock

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Nova Conductors

Japan . 57 parts In-Stock

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Vyrian

USA . 6,318 parts In-Stock

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Digiode

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Anansix

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One Stop Electronics

USA . 6,365 parts In-Stock

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$16.000

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Semicontronic

India . 6,175 parts In-Stock

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$23.000

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$22.425

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$22.310

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Continental Prestige Electronics

USA . 6,574 parts In-Stock

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Ampacity Inc.

Singapore . 6,117 parts In-Stock

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$31.000

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Aztec Data Supply Inc.

USA . 228 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Corohmni

South Africa . 1,091 parts In-Stock

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Microchip USA

USA . 227 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

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Corphita

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Glotronic Ltd.

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Robosynatics

Brazil . 1,735 parts In-Stock

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Lucentia Tech

USA . 1,735 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Perfect Parts

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Netroflash

USA . 500 parts In-Stock

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GreenTree Electronics

Israel . 52 parts In-Stock

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Overview

Elevate your projects with the MCHC11F1CFNE4R by NXP Semiconductors, a top-quality microcontroller designed to exceed expectations. Manufactured by industry leader NXP Semiconductors, this chip boasts a wide range of applications and features that promise unmatched performance. From its high-speed processing capabilities to its versatile design, this microcontroller is a game-changer in the tech world. Discover the value and benefits of using the MCHC11F1CFNE4R today and unlock a whole new level of innovation for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly, saving space and reducing production costs.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources and applications.

Address Bus Width: 16

A wider address bus allows for more memory addressing capabilities, enabling the microcontroller to handle larger and more complex programs.

Bit Size: 8

An 8-bit architecture provides a good balance between performance and cost, making it suitable for a variety of applications.

No. of Terminals: 68

Having a high number of terminals allows for versatile connectivity options and expansion capabilities.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good heat dissipation and electrical performance, enhancing the overall reliability of the product.

Minimum Supply Voltage: 4.75 V

With a low minimum supply voltage, this microcontroller can operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function in extreme cold environments without issues.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals to digital data, enabling a wider range of input sources.

Width: 24.23 mm

The compact width of this microcontroller makes it suitable for applications where space is limited.

External Data Bus Width: 8

An 8-bit external data bus facilitates data transfer between the microcontroller and external devices, enhancing overall system performance.

Maximum Clock Frequency: 16 MHz

A high maximum clock frequency provides fast processing speeds, making the microcontroller ideal for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time allows for quick and efficient soldering during production, reducing manufacturing time and costs.

Peak Reflow Temperature °C: 250

Being able to withstand high reflow temperatures ensures that the microcontroller remains reliable throughout the assembly process.

Length: 24.23 mm

The small length of this microcontroller contributes to a compact and space-saving design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions and industrial environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals on a single chip, simplifying system design and reducing component count.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

Terminal Form: J BEND

J bend terminals provide reliable electrical connections and easy soldering during assembly, ensuring a high-quality end product.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V is common and widely compatible with many electronics, making this microcontroller versatile in various applications.

ROM Programmability: EEPROM

Being programmable with EEPROM offers flexibility and convenience for updating firmware and customizing the microcontroller's functionality.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27mm allows for easy integration with standard PCB layouts and components, simplifying assembly and maintenance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, which is suitable for most assembly processes and environments.

Speed: 4 rpm

With a speed of 4 rpm, this microcontroller can handle processing tasks efficiently and quickly, meeting the requirements of various applications.

No. of I/O Lines: 54

Having 54 I/O lines allows for versatile input and output configurations, enabling the microcontroller to interface with a wide range of external devices and sensors.

Technical Specifications

Microcontrollers MCHC11F1CFNE4R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e3

Length:

24.23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

250

ROM Programmability:

EEPROM

Speed:

4 rpm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

MCHC11F1CFNE4R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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