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MCHC11F1CFNE3R

NXP Semiconductors

MCHC11F1CFNE3R by NXP Semiconductors

NXP Semiconductors' MCHC11F1CFNE3R microcontroller features 16-bit address bus, 8-bit bit size, and 12 MHz clock frequency. Ideal for industrial applications requiring a CMOS technology-based microcontroller with 54 I/O lines and ADC channels. Package style is chip carrier with J bend terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

MCHC11F1CFNE3R by NXP Semiconductors
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Digiode

USA . 3,684 parts In-Stock

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Anansix

USA . 1,809 parts In-Stock

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Vyrian

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 1,417 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 221 parts In-Stock

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$19.307

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Aztec Data Supply Inc.

USA . 82 parts In-Stock

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$29.580

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Semicontronic

India . 321 parts In-Stock

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$30.000

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$29.250

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One Stop Electronics

USA . 543 parts In-Stock

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$35.000

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Corohmni

South Africa . 91 parts In-Stock

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Modulus Dynamics

Lithuania . 1,553 parts In-Stock

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Advanced Electronics

New Zealand . 18 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,247 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

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Continental Prestige Electronics

USA . 3,033 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Corphita

USA . 1,480 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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UNI Independent Distributors

Spain . 475 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 120 parts In-Stock

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Robosynatics

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Lucentia Tech

USA . 31 parts In-Stock

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$52.149

Overview

Unleash the power of innovation with the MCHC11F1CFNE3R microcontroller by NXP Semiconductors. Designed with precision and expertise, this chip offers unparalleled performance and reliability for a wide range of applications. From smart home devices to automotive systems, this versatile microcontroller delivers cutting-edge technology that exceeds customer expectations. Experience seamless integration and enhanced functionality with the MCHC11F1CFNE3R, setting new standards in the world of microcontrollers. Elevate your projects to new heights with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to harsh environments, increasing the product's reliability.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and space.

Maximum Supply Voltage: 5.25 V

High maximum supply voltage tolerance provides flexibility in the power supply design, accommodating various voltage levels.

Address Bus Width: 16

Wide address bus width allows for larger memory addressing capability, supporting complex applications.

Bit Size: 8

8-bit architecture enables the microcontroller to process data in 8-bit chunks, suitable for many low to mid-range computing tasks.

No. of Terminals: 68

Having a high number of terminals allows for more I/O connections and peripherals to be interfaced, enhancing the product's functionality.

Minimum Supply Voltage: 4.75 V

Low minimum supply voltage ensures compatibility with lower voltage power sources, increasing the product's versatility.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in various industrial environments, minimizing the risk of overheating.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature capability allows the microcontroller to function even in extreme cold conditions.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion directly on the microcontroller, simplifying sensor interfacing and data acquisition.

Maximum Clock Frequency: 12 MHz

High maximum clock frequency supports fast data processing and communication, suitable for real-time applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripheral functionality in a single chip, reducing system complexity and cost.

Technical Specifications

Microcontrollers MCHC11F1CFNE3R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e3

Length:

24.23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

250

Speed:

3 rpm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

MCHC11F1CFNE3R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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